Loads on click. Unloads only if this page sits in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads on click. Unloads only if this page sits in the background.

PCB Footprint

Open full view ↗
Loads on click. Unloads only if this page sits in the background.
Loads on click. Unloads only if this page sits in the background.
Download PDF
Contents

README

markdown

THS3001IDGNR

Texas Instruments · Operational Amplifier · HVSSOP-8-EP

THS3001IDGNR from Texas Instruments, in a HVSSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection.
2 IN- input Inverting input; per the layout guidance, keep its PCB trace as short as possible and remove the ground plane under connected etch runs to limit stray capacitance that can cause oscillation.
3 IN+ input Noninverting input of the amplifier.
4 VCC- power_in Negative power-supply connection; the datasheet recommends a dual supply of ±4.5 V to ±16 V or a single supply of 9 V to 32 V.
5 NC unconnected No internal connection.
6 OUT output Amplifier output; the absolute maximum output current is 175 mA.
7 VCC+ power_in Positive power-supply connection; the datasheet recommends a dual supply of ±4.5 V to ±16 V or a single supply of 9 V to 32 V.
8 NC unconnected No internal connection.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HVSSOP-8-EP
Category Amplifiers/Comparators
Pins 9

CAD (KiCad official)

  • Symbol: THS3001IDGNR
  • Footprint: Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm
  • 3D model: HVSSOP-8-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: ths3001idgnr-etched.step / ths3001idgnr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ths3001idgnr.step / ths3001idgnr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (43 pp, sha256 23633aaa07412b2d, retrieved 2026-10-07, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF