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tf21364m-tlh
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TFSS Gate Drive ICs, SOIC-28-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TF21364M-TLH
TFSS · Gate Drive ICs · SOIC-28-300mil
TF21364M-TLH from TFSS, in a SOIC-28-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Low-side and logic fixed supply; recommended operating range is 10V to 20V. |
| 2 | HIN1 | input | Logic input for high-side gate driver output HO1, in phase with HO. |
| 3 | HIN2 | input | Logic input for high-side gate driver output HO2, in phase with HO. |
| 4 | HIN3 | input | Logic input for high-side gate driver output HO3, in phase with HO. |
| 5 | LIN1 | input | Logic input for low-side gate driver output LO1, in phase with LO. |
| 6 | LIN2 | input | Logic input for low-side gate driver output LO2, in phase with LO. |
| 7 | LIN3 | input | Logic input for low-side gate driver output LO3, in phase with LO. |
| 8 | FO* | output | Fault output with open drain, signalling over-current and VCC UVLO faults. |
| 9 | ITRIP | input | Analog input for over-current shutdown. |
| 10 | EN | input | Logic input for functionality; I/O logic functions when EN is high. |
| 11 | RCIN | passive | External RC network input used to define the FAULT CLEAR delay. |
| 12 | VSS | power_in | Logic ground. |
| 13 | COM | power_in | Low-side driver return. |
| 14 | LO3 | output | Low-side gate driver output for phase 3. |
| 15 | LO2 | output | Low-side gate driver output for phase 2. |
| 16 | LO1 | output | Low-side gate driver output for phase 1. |
| 17 | NC | unconnected | No Connect. |
| 18 | VS3 | power_in | High-side floating supply return for phase 3. |
| 19 | HO3 | output | High-side gate driver output for phase 3. |
| 20 | VB3 | power_in | High-side floating supply for phase 3. |
| 21 | NC | unconnected | No Connect. |
| 22 | VS2 | power_in | High-side floating supply return for phase 2. |
| 23 | HO2 | output | High-side gate driver output for phase 2. |
| 24 | VB2 | power_in | High-side floating supply for phase 2. |
| 25 | NC | unconnected | No Connect. |
| 26 | VS1 | power_in | High-side floating supply return for phase 1. |
| 27 | HO1 | output | High-side gate driver output for phase 1. |
| 28 | VB1 | power_in | High-side floating supply for phase 1. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TFSS |
| Package | SOIC-28-300mil |
| Category | Power Management ICs |
| Pins | 28 |
CAD (KiCad official)
- Symbol:
TF21364M-TLH - Footprint:
Package_SO:SOIC-28W_7.5x17.9mm_P1.27mm - 3D model: SOIC-28-300mil (KiCad packages3D, STEP)
- 3D model files:
tf21364m-tlh-etched.step/tf21364m-tlh-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tf21364m-tlh.step/tf21364m-tlh.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TFSS datasheet (10 pp, sha256
a46c0e33c985907f, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TF21364M-TLH
**TFSS** · Gate Drive ICs · SOIC-28-300mil
TF21364M-TLH from TFSS, in a SOIC-28-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Low-side and logic fixed supply; recommended operating range is 10V to 20V. |
| 2 | HIN1 | input | Logic input for high-side gate driver output HO1, in phase with HO. |
| 3 | HIN2 | input | Logic input for high-side gate driver output HO2, in phase with HO. |
| 4 | HIN3 | input | Logic input for high-side gate driver output HO3, in phase with HO. |
| 5 | LIN1 | input | Logic input for low-side gate driver output LO1, in phase with LO. |
| 6 | LIN2 | input | Logic input for low-side gate driver output LO2, in phase with LO. |
| 7 | LIN3 | input | Logic input for low-side gate driver output LO3, in phase with LO. |
| 8 | FO* | output | Fault output with open drain, signalling over-current and VCC UVLO faults. |
| 9 | ITRIP | input | Analog input for over-current shutdown. |
| 10 | EN | input | Logic input for functionality; I/O logic functions when EN is high. |
| 11 | RCIN | passive | External RC network input used to define the FAULT CLEAR delay. |
| 12 | VSS | power_in | Logic ground. |
| 13 | COM | power_in | Low-side driver return. |
| 14 | LO3 | output | Low-side gate driver output for phase 3. |
| 15 | LO2 | output | Low-side gate driver output for phase 2. |
| 16 | LO1 | output | Low-side gate driver output for phase 1. |
| 17 | NC | unconnected | No Connect. |
| 18 | VS3 | power_in | High-side floating supply return for phase 3. |
| 19 | HO3 | output | High-side gate driver output for phase 3. |
| 20 | VB3 | power_in | High-side floating supply for phase 3. |
| 21 | NC | unconnected | No Connect. |
| 22 | VS2 | power_in | High-side floating supply return for phase 2. |
| 23 | HO2 | output | High-side gate driver output for phase 2. |
| 24 | VB2 | power_in | High-side floating supply for phase 2. |
| 25 | NC | unconnected | No Connect. |
| 26 | VS1 | power_in | High-side floating supply return for phase 1. |
| 27 | HO1 | output | High-side gate driver output for phase 1. |
| 28 | VB1 | power_in | High-side floating supply for phase 1. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TFSS |
| Package | SOIC-28-300mil |
| Category | Power Management ICs |
| Pins | 28 |
## CAD (KiCad official)
- Symbol: `TF21364M-TLH`
- Footprint: `Package_SO:SOIC-28W_7.5x17.9mm_P1.27mm`
- 3D model: SOIC-28-300mil (KiCad packages3D, STEP)
- 3D model files: `tf21364m-tlh-etched.step` / `tf21364m-tlh-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tf21364m-tlh.step` / `tf21364m-tlh.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [TFSS datasheet](docs/tf21364m-tlh-datasheet.pdf) (10 pp, sha256 `a46c0e33c985907f`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tf21364m-tlh-datasheet.pdf)