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TEA2025N

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HGSEMI Audio Amplifiers, DIP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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TEA2025N

HGSEMI · Audio Amplifiers · DIP-16

TEA2025N from HGSEMI, in a DIP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 AUXBTL passive BTL auxiliary pin, used when the amplifier is configured in bridge (BTL) mode; the datasheet gives no electrical limits for this pin.
2 2OUT output Channel 2 power output driving the speaker load; the device has a peak output current rating of 1.5 A.
3 2BS passive Channel 2 bootstrap pin, connected to the channel 2 output stage; the datasheet gives no further limits for this pin.
4 2GNDp power_in Channel 2 power amplifier ground, which should be connected to the channel 2 output stage ground return.
5 2GNDp power_in Channel 2 power amplifier ground (second pin, internally paired with pin 4); the datasheet gives no further limits for this pin.
6 2FB passive Channel 2 feedback pin that sets the closed-loop voltage gain together with external resistors; the datasheet gives no further limits for this pin.
7 2IN input Channel 2 audio signal input to the power amplifier.
8 FIL passive Filter pin for the internal reference node; the datasheet gives no further limits for this pin.
9 GND power_in Signal ground of the IC.
10 1IN input Channel 1 audio signal input to the power amplifier.
11 1FB passive Channel 1 feedback pin that sets the closed-loop voltage gain together with external resistors; the datasheet gives no further limits for this pin.
12 1GNDp power_in Channel 1 power amplifier ground, which should be connected to the channel 1 output stage ground return.
13 1GNDp power_in Channel 1 power amplifier ground (second pin, internally paired with pin 12); the datasheet gives no further limits for this pin.
14 1BS passive Channel 1 bootstrap pin, connected to the channel 1 output stage; the datasheet gives no further limits for this pin.
15 1OUT output Channel 1 power output driving the speaker load; the device has a peak output current rating of 1.5 A.
16 Vcc power_in Positive supply pin; the datasheet gives an operating supply range of 3 V to 12 V and an absolute maximum of 15 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-16
Category Amplifiers/Comparators
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (absolute maximum) Vcc 15 V 3
Output peak current Iop 1.5 A 3
Junction temperature Tj 150 ℃ 3
Storage temperature Ts -40 150 ℃ 3
Lead temperature (soldering) TLEAD 260 ℃ Soldering, 10 s 3
Supply voltage (recommended range) Vcc 3 12 V 3
Quiescent current Icco 40 50 mW 3
Static output voltage VO(DC) 4 4.5 5 V 3
Closed-loop voltage gain, dual-channel mode AVF 43 45 47 dB Dual-channel mode 3
Closed-loop voltage gain, BTL mode AVF 49 51 53 dB BTL mode 3
Channel balance CB -1 1 dB 3
Total harmonic distortion, dual-channel THD 0.3 1.5 % RL=4Ω, Po=250mW, Vcc=9V, f=1kHz; dual-channel 3
Channel separation CSR 40 55 dB Rg=10kΩ, f=1kHz, RL=4Ω, Po=1W 3
Ripple rejection Srip 40 46 dB Rg=0, frip=100Hz, Vrip=150Mv, Av=45dB 3
Input noise voltage VNI 1.5 3 μV BW 20Hz~20kHz, Av=200, Rg=0 3
Input noise voltage VNI 3 6 μV BW 20Hz~20kHz, Av=200, Rg=10kΩ 3
Output power, dual-channel, Vcc=9V, RL=4Ω Po 1.7 2.3 W THD=10%, f=1kHz, dual-channel 3
Output power, dual-channel, Vcc=6V, RL=4Ω Po 0.7 1 W THD=10%, f=1kHz, dual-channel 3
Thermal resistance, junction to case Rth(j-c) 15 ℃/W Junction to case 3
Thermal resistance, junction to ambient Rth(j-a) 60 ℃/W Junction to ambient; glass-epoxy PCB 10×5×0.15 cm, 5 cm² 35 µm copper 3
Total harmonic distortion, BTL mode THD 0.5 % RL=4Ω, Po=250mW, Vcc=9V, f=1kHz; BTL 3
Input impedance Zi 30 KΩ 3
Output power, dual-channel, Vcc=12V, RL=8Ω Po 2.3 W THD=10%, f=1kHz, dual-channel 3
Output power, dual-channel, Vcc=9V, RL=8Ω Po 1.3 W THD=10%, f=1kHz, dual-channel 3
Output power, dual-channel, Vcc=6V, RL=8Ω Po 0.6 W THD=10%, f=1kHz, dual-channel 3
Output power, dual-channel, Vcc=3V, RL=4Ω Po 0.1 W THD=10%, f=1kHz, dual-channel 3
Output power, BTL mode, Vcc=9V, RL=8Ω Po 4.7 W THD=10%, f=1kHz, BTL mode 3
Output power, BTL mode, Vcc=6.8V, RL=4Ω Po 2.8 W THD=10%, f=1kHz, BTL mode 3

CAD (KiCad official)

  • Symbol: TEA2025N
  • Footprint: Package_DIP:DIP-16_W7.62mm
  • 3D model: DIP-16 (KiCad packages3D, STEP)
  • 3D model files: tea2025n-etched.step / tea2025n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tea2025n.step / tea2025n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (8 pp, sha256 3904083f572a012a, retrieved 2026-10-14, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF