component
TEA2025M
Public Made by Adomby adom
HGSEMI Audio Amplifiers, SOP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTEA2025M
HGSEMI · Audio Amplifiers · SOP-16
TEA2025M from HGSEMI, in a SOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AUXBTL | passive | BTL auxiliary pin, used for the bridge-tied-load connection; the datasheet gives no electrical limits for this pin. |
| 2 | 2OUT | output | Channel 2 power amplifier output, driving the channel 2 load. |
| 3 | 2BS | passive | Channel 2 bootstrap pin for the channel 2 output stage; no electrical limits are given in the datasheet. |
| 4 | 2GNDp | power_in | Channel 2 power amplifier ground; pin 4 and pin 5 are both channel 2 power ground. |
| 5 | 2GNDp | power_in | Channel 2 power amplifier ground; pin 4 and pin 5 are both channel 2 power ground. |
| 6 | 2FB | input | Channel 2 feedback pin for setting the channel 2 closed-loop gain; the datasheet notes that gain can be adjusted with an external resistor. |
| 7 | 2IN | input | Channel 2 audio signal input; input impedance is typically 30 kΩ per the electrical characteristics. |
| 8 | FIL | passive | Filter pin for the internal reference/filter network; the datasheet gives no electrical limits for this pin. |
| 9 | GND | power_in | Signal ground for the IC. |
| 10 | 1IN | input | Channel 1 audio signal input; input impedance is typically 30 kΩ per the electrical characteristics. |
| 11 | 1FB | input | Channel 1 feedback pin for setting the channel 1 closed-loop gain; the datasheet notes that gain can be adjusted with an external resistor. |
| 12 | 1GNDp | power_in | Channel 1 power amplifier ground; pin 12 and pin 13 are both channel 1 power ground. |
| 13 | 1GNDp | power_in | Channel 1 power amplifier ground; pin 12 and pin 13 are both channel 1 power ground. |
| 14 | 1BS | passive | Channel 1 bootstrap pin for the channel 1 output stage; no electrical limits are given in the datasheet. |
| 15 | 1OUT | output | Channel 1 power amplifier output, driving the channel 1 load. |
| 16 | Vcc | power_in | Positive supply; operating range 3 V to 12 V, absolute maximum 15 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-16 |
| Category | Amplifiers/Comparators |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| 电源电压 Supply voltage (absolute maximum) | Vcc | 15 | V | 3 | |||
| 输出峰值电流 Output peak current | Iop | 1.5 | A | 3 | |||
| 结温 Junction temperature | Tj | 150 | ℃ | 3 | |||
| 贮存温度 Storage temperature | Ts | -40 | 150 | ℃ | 3 | ||
| 引脚温度 Lead temperature (soldering) | TLEAD | 260 | ℃ | Soldering 10 s | 3 | ||
| 电源电压 Supply voltage | Vcc | 3 | 12 | V | 3 | ||
| 静态电流 Quiescent current | Icco | 40 | 50 | mW | 3 | ||
| 静态输出电压 Static output voltage | VO(DC) | 4 | 4.5 | 5 | V | 3 | |
| 闭环电压增益 Closed-loop voltage gain, dual-channel mode | AVF | 43 | 45 | 47 | dB | 双通道模式 (dual-channel mode) | 3 |
| 闭环电压增益 Closed-loop voltage gain, BTL mode | AVF | 49 | 51 | 53 | dB | BTL模式 (BTL mode) | 3 |
| 通道平衡度 Channel balance | CB | -1 | 1 | dB | 3 | ||
| 全谐波失真度 Total harmonic distortion, dual-channel | THD | 0.3 | 1.5 | % | RL=4Ω, Po=250mW, Vcc=9V, f=1kHz; 双通道 (dual-channel) | 3 | |
| 通道隔离度 Channel separation | CSR | 40 | 55 | dB | Rg=10kΩ, f=1kHz, RL=4Ω, Po=1W | 3 | |
| 纹波抑制比 Ripple rejection | Srip | 40 | 46 | dB | Rg=0, frip=100Hz, Vrip=150Mv, Av=45dB | 3 | |
| 输入噪声电压 Input noise voltage | VNI | 1.5 | 3 | μV | BW: 20Hz~20KHz, Av=200, Rg=0 | 3 | |
| 输入噪声电压 Input noise voltage | VNI | 3 | 6 | μV | BW: 20Hz~20KHz, Av=200, Rg=10kΩ | 3 | |
| 输出功率 Output power, dual-channel | Po | 1.7 | 2.3 | W | THD=10%, f=1kHz, dual-channel mode, Vcc=9V, RL=4Ω | 3 | |
| 输出功率 Output power, dual-channel | Po | 0.7 | 1 | W | THD=10%, f=1kHz, dual-channel mode, Vcc=6V, RL=4Ω | 3 | |
| 结到基座热阻 Junction-to-case thermal resistance | Rth(j-c) | 15 | ℃/W | 3 | |||
| 结到环境热阻 Junction-to-ambient thermal resistance | Rth(j-a) | 60 | ℃/W | Mounted on 10×5×0.15 cm glass-epoxy PCB with 5 cm² of 35 µm copper | 3 |
CAD (KiCad official)
- Symbol:
TEA2025M - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOP-16 (KiCad packages3D, STEP)
- 3D model files:
tea2025m-etched.step/tea2025m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tea2025m.step/tea2025m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (8 pp, sha256
3904083f572a012a, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).