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TDZ30J

Nexperia · Zener Diodes · SOD-323F

TDZ30J from Nexperia, in a SOD-323F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, marked by the marking bar on the package; Zener working voltage for TDZ30J is 29.4 V to 30.6 V at IZ = 2 mA.
2 A passive Anode; forward voltage is at most 1.1 V at IF = 100 mA and forward current is limited to 250 mA.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-323F
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage VZ 29.4 30.6 V IZ = 2 mA, Tj = 25 C 5
Differential resistance rdif 250 Ω IZ = 2 mA, Tj = 25 C 5
Differential resistance rdif 40 Ω IZ = 0.5 mA, Tj = 25 C 5
Reverse current IR 0.05 µA VR = 21 V, Tj = 25 C 5
Temperature coefficient SZ 24.4 29.4 mV/K IZ = 2 mA, Tj = 25 C 5
Diode capacitance Cd 66 pF f = 1 MHz; VR = 0 V 5
Non-repetitive peak reverse current IZSM 1 A tp = 100 µs; square wave; Tj = 25 C before surge 5
Forward voltage VF 0.9 V IF = 10 mA 3
Forward voltage VF 1.1 V IF = 100 mA 3
Forward current IF 250 mA 3
Non-repetitive peak reverse power dissipation PZSM 40 W TDZ7V5J to TDZ30J; tp = 100 µs; square wave; Tj = 25 C before surge 3
Total power dissipation Ptot 500 mW Tamb ≤ 25 C; FR4 PCB, cathode pad 16 mm2 3
Junction temperature Tj 150 C 3
Ambient temperature Tamb -55 150 C 3
Storage temperature Tstg -65 150 C 3
Thermal resistance from junction to ambient Rth(j-a) 250 K/W in free air; FR4 PCB, cathode pad 16 mm2 3
Thermal resistance from junction to solder point Rth(j-sp) 25 K/W soldering point of cathode tab 3

CAD (KiCad official)

  • Symbol: TDZ30J
  • Footprint: Diode_SMD:D_SOD-323F
  • 3D model: SOD-323F (KiCad packages3D, STEP)
  • 3D model files: tdz30j-etched.step / tdz30j-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tdz30j.step / tdz30j.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (12 pp, sha256 4abbeb9e227df5d0, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF