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TD1509PR

Techcode Semicon · DC-DC Converters · SOP-8

TD1509PR from Techcode Semicon, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Vin power_in Positive input supply for the switching regulator, specified at 3.6 V to 45 V, and a suitable input bypass capacitor must be present at this pin to minimize voltage transients.
2 Output output Internal switch output that swings between (+VIN - VSAT) and approximately -0.5 V at a duty cycle of about VOUT/VIN, so the PC board copper area connected to it should be kept minimal.
3 FB input Senses the regulated output voltage to complete the feedback loop; the adjustable version uses a 1.23 V reference, with FB rated from -0.3 V to Vin+0.3 V.
4 ON/OFF input Logic-level shutdown input: pulling it below about 1.3 V turns the regulator on and pulling it above 1.3 V (up to a maximum of 25 V) shuts it down, and leaving it open or tying it to ground keeps the regulator always on.
5 GND power_in Circuit ground, to be connected to a ground plane together with the input and output capacitors, with a maximized copper area recommended for heat dissipation.
6 GND power_in Circuit ground, to be connected to a ground plane together with the input and output capacitors, with a maximized copper area recommended for heat dissipation.
7 GND power_in Circuit ground, to be connected to a ground plane together with the input and output capacitors, with a maximized copper area recommended for heat dissipation.
8 GND power_in Circuit ground, to be connected to a ground plane together with the input and output capacitors, with a maximized copper area recommended for heat dissipation.

Key specifications

Parameter Value
Manufacturer Techcode Semicon
Package SOP-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage (ADJ) Vout 1.18 1.23 1.28 V 11V≤VIN≤45V, 0.2A≤ILOAD≤3A, VOUT for 9V 6
Feedback bias current Ib 10 100 nA Adjustable only, VFB=1.3V 5
Quiescent current IQ 5 10 mA VFB=12V force driver off 5
Standby quiescent current ISTBY 80 250 uA ON/OFF=5V, VIN=36V 5
Oscillator frequency FOSC 127 150 173 KHz 5
Saturation voltage VSAT 1.2 1.5 V IOUT=3A 5
Current limit (peak current) ICL 3.8 4.2 A Peak Current (VFB=0V) 5
Output leakage current IL 50 uA Output=0V (VFB=12V) 5
Output leakage current IL 2 30 mA Output=-1V (VIN=36V) 5
ON/OFF pin threshold voltage, low (regulator ON) VIL 0.6 1.3 V Low (Regulator ON) 5
ON/OFF pin threshold voltage, high (regulator OFF) VIH 1.3 2 V High (Regulator OFF) 5
ON/OFF pin input current, high IH 5 15 uA VLOGIC=2.5V (Regulator OFF) 5
ON/OFF pin input current, low IL 0.02 5 uA VLOGIC=0.5V (Regulator ON) 5
Input voltage VIN 3.6 45 V 4
Operating junction temperature TJ -40 125 ºC 4
Operating ambient temperature TA -40 85 ºC 4
Input voltage VIN -0.3 45 V 4
Feedback pin voltage VFB -0.3 V Upper limit printed as Vin+0.3 V (not numeric) 4
ON/OFF pin voltage VEN -0.3 V Upper limit printed as Vin+0.3 V (not numeric) 4
Output pin voltage VSW -0.3 V Upper limit printed as Vin+0.3 V (not numeric) 4
Operating junction temperature TJ 150 ºC 4
Storage temperature TSTG -65 150 ºC 4
Lead temperature (soldering, 10 sec) TLEAD 260 ºC Soldering, 10 sec 4
ESD (HBM) 2000 V HBM 4
Thermal resistance junction to ambient RθJA 85 ºC/W Note1: thermal resistance with copper area of approximately 3 in2 5
Thermal resistance junction to case RθJC 45 ºC/W 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper this is the output (switch) pin, which should not have large areas of copper.) Large areas of copper provide the 12

CAD (KiCad official)

  • Symbol: TD1509PR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: td1509pr-etched.step / td1509pr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); td1509pr.step / td1509pr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Techcode Semicon datasheet (17 pp, sha256 8d1cdb542e62ec93, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF