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TD1410P

Techcode Semicon · DC-DC Converters · SOIC-8

TD1410P from Techcode Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected Not connected. Leave floating or tie to a stable DC node per layout best practice.
2 VIN power_in Supply voltage input pin. TD1410 operates from a 3.6 V to 20 V DC input (absolute max 20 V). Bypass VIN to GND with a suitably large low-ESR capacitor (>10 µF) to eliminate switching noise and supply the discontinuous switching current.
3 SW output Power switch output pin (internal PMOS drain). Voltage swings between (VIN - VSAT) and approximately -0.5 V with a duty cycle of about VOUT/VIN. Connect to the external inductor and Schottky catch diode; keep PCB copper area minimal to reduce EMI coupling.
4 GND power_in Ground pin. Should be routed outside the Schottky-diode-to-output-capacitor ground path to prevent switching current spikes from inducing voltage noise into the IC. Use a ground plane to connect input cap, output cap, and this pin.
5 FB input Feedback pin. Senses the output voltage through an external resistor divider and regulates it to the internal 1.222 V reference (VFB typ 1.222 V, 1.185-1.26 V). Feedback bias current is 0.1 µA typ (0.5 µA max). Keep FB trace away from the SW node.
6 NC unconnected Not connected. Leave floating or tie to a stable DC node per layout best practice.
7 EN input Enable pin. Digital input that turns the regulator on/off; drive high to enable, low to shut down (shutdown supply current ~30 µA). Threshold typ 1.2 V (0.7 V min, 1.7 V max). Absolute maximum EN voltage is 12 V. For automatic startup, a resistive divider from VIN to GND may be used.
8 NC unconnected Not connected. Leave floating or tie to a stable DC node per layout best practice.

Key specifications

Parameter Value
Manufacturer Techcode Semicon
Package SOIC-8
Category PMIC
Pins 8

Ordering variants

  • TD1410PP
  • TD1410PPR

CAD (KiCad official)

  • Symbol: TD1410P
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: td1410p-etched.step / td1410p-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); td1410p.step / td1410p.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Techcode Semicon datasheet (None pp, sha256 1688a85fc3d47830, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

Symbol & Footprint

Schematic Symbol

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PCB Footprint

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