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TCM809SENB713

Microchip Tech · Supervisor And Reset ICs · SOT-23-3

TCM809SENB713 from Microchip Tech, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 RESET output Active-low push-pull reset output (TCM809) that stays low while VDD is below the reset threshold and for 240 ms (140 ms minimum) after VDD rises above it, and remains valid down to VDD = 1.0V.
3 VDD power_in Supply voltage being monitored (+2.5V, +3.0V, +3.3V or +5.0V nominal), absolute maximum 6.0V.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOT-23-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VDD range (TA = 0°C to +70°C) VDD 1 5.5 V TA = 0°C to +70°C 2
VDD range (TA = -40°C to +125°C) VDD 1.2 5.5 V TA = -40°C to +125°C 2
Supply current (SOT-23) ICC 17 50 µA TCM8xxR/S/T/Z: VDD < 3.6V 2
Reset threshold voltage (TCM8xxS) VTH 2.89 2.93 2.96 V TCM8xxS: TA = +25°C 2
Reset threshold voltage (TCM8xxS, full temperature range) VTH 2.85 3 V TCM8xxS: TA = -40°C to +125°C 2
Reset threshold temperature coefficient 30 ppm/°C 2
VDD reset delay (SOT-23) 20 µs VDD = VTH to (VTH, 100 mV) 2
Reset active timeout period (SOT-23) 140 240 560 ms 2
RESET low output voltage (TCM809) VOL 0.3 V TCM809R/S/T/Z: VDD = VTH min, ISINK = 1.2 mA 2
RESET low output voltage (TCM809, low-current test) VOL 0.3 V VDD > 1.0V, ISINK = 50 µA 2
RESET high output voltage (TCM809) VOH 0.8 VDD TCM809R/S/T/Z: VDD > VTH max, ISOURCE = 500 µA 2
RESET, RESET pin voltage -0.3 V Upper limit printed as (VDD + 0.3 V) 2
VDD pin input current 20 mA 2
RESET, RESET pin output current 20 mA 2
dV/dt (VDD) dV/dt 100 V/µs 2
Operating temperature range (absolute maximum) -40 125 °C 2
Power dissipation (SOT-23B) 320 mW TA = 70°C; derate 4 mW/°C above +70°C 2
Storage temperature range -65 150 °C 2
Maximum junction temperature TJ 150 °C 2
Operating temperature range (E grade, per part-number table) -40 85 °C E = -40°C to +85°C (temperature range suffix E in MPN) 13

CAD (KiCad official)

  • Symbol: TCM809SENB713
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: tcm809senb713-etched.step / tcm809senb713-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tcm809senb713.step / tcm809senb713.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (16 pp, sha256 8dcd25a289a52a8f, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF