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Ray Publish 0.1.0 102e986 7d ago

TC7660M

HGSEMI · DC-DC Converters · SOP-8

TC7660M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection; the datasheet lists this pin as not connected.
2 CAP+ passive Positive terminal of the external pump capacitor C1, charged to V+ during the first half cycle.
3 GND power_in Ground pin.
4 CAP- passive Negative terminal of the external pump capacitor C1, shifted to -V+ during the second half cycle.
5 Vout power_out Negative voltage output (nominally -V+); do not short the output to V+ above 5.5V for extended periods.
6 LV input Low-voltage selection pin: connect to GND to disable the internal regulator for better low-voltage operation, and leave open for supply voltages above 3.5V.
7 OSC passive Oscillator pin: left open for the nominal 10 kHz frequency, or connect an external capacitor to ground to lower the oscillator frequency.
8 V+ power_in Positive supply input, 2.5V to 9V operating range (absolute maximum input voltage +9V).

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power Efficiency PEFF 95 98 % RL=5kΩ 3
Voltage Conversion Efficiency VOUTEFF 98 99.9 % RL=∞ 3
Supply Current I+ 40 100 µA RL=∞ 3
Supply Voltage, High V+H 3.5 8 V LV Open 3
Supply Voltage, Low V+L 2.5 3.5 V LV to GND 3
Output Resistance ROUT 70 Ω IOUT=20mA, TA=25℃ 3
Output Resistance ROUT 120 Ω IOUT=5mA, V+=3V, TA=25℃ 3
Input voltage VIN 9 V 3
LV pin input current ILV 20 µA V+>3.5V 3
Total Power Dissipation (SOP8) Pd 470 mW TA≤75℃ 3
Operating Ambient Temperature TOpr -25 60 ℃ 3
Storage Temperature Tstg -65 150 ℃ 3
Soldering temperature and time Tsolder 260 ℃ 10s 3
Lead Temperature (Soldering) TL 260 ℃ 10 seconds 3

CAD (KiCad official)

  • Symbol: TC7660M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: tc7660m-etched.step / tc7660m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tc7660m.step / tc7660m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (12 pp, sha256 bf1e0e914f19840a, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF