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Contents

README

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TBD62783AFWG

TOSHIBA · Power Distribution Switches · SOIC-18-300mil

TBD62783AFWG from TOSHIBA, in a SOIC-18-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I1 input Input pin for channel 1, accepts 2.0-25 V for output on and ≤0.6 V for output off.
2 I2 input Input pin for channel 2, accepts 2.0-25 V for output on and ≤0.6 V for output off.
3 I3 input Input pin for channel 3, accepts 2.0-25 V for output on and ≤0.6 V for output off.
4 I4 input Input pin for channel 4, accepts 2.0-25 V for output on and ≤0.6 V for output off.
5 I5 input Input pin for channel 5, accepts 2.0-25 V for output on and ≤0.6 V for output off.
6 I6 input Input pin for channel 6, accepts 2.0-25 V for output on and ≤0.6 V for output off.
7 I7 input Input pin for channel 7, accepts 2.0-25 V for output on and ≤0.6 V for output off.
8 I8 input Input pin for channel 8, accepts 2.0-25 V for output on and ≤0.6 V for output off.
9 VCC power_in Power supply pin, operating range 2.0-50 V.
10 GND power_in Ground reference pin.
11 O8 output Output pin for channel 8, sinks up to -500 mA at output voltages up to 50 V with internal clamp diode.
12 O7 output Output pin for channel 7, sinks up to -500 mA at output voltages up to 50 V with internal clamp diode.
13 O6 output Output pin for channel 6, sinks up to -500 mA at output voltages up to 50 V with internal clamp diode.
14 O5 output Output pin for channel 5, sinks up to -500 mA at output voltages up to 50 V with internal clamp diode.
15 O4 output Output pin for channel 4, sinks up to -500 mA at output voltages up to 50 V with internal clamp diode.
16 O3 output Output pin for channel 3, sinks up to -500 mA at output voltages up to 50 V with internal clamp diode.
17 O2 output Output pin for channel 2, sinks up to -500 mA at output voltages up to 50 V with internal clamp diode.
18 O1 output Output pin for channel 1, sinks up to -500 mA at output voltages up to 50 V with internal clamp diode.

Key specifications

Parameter Value
Manufacturer TOSHIBA
Package SOIC-18-300mil
Category Power Management (PMIC)
Pins 18

CAD (KiCad official)

  • Symbol: TBD62783AFWG
  • Footprint: Package_SO:SOIC-18W_7.5x11.6mm_P1.27mm
  • 3D model: SOIC-18-300mil (KiCad packages3D, STEP)
  • 3D model files: tbd62783afwg-etched.step / tbd62783afwg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tbd62783afwg.step / tbd62783afwg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TOSHIBA datasheet (11 pp, sha256 badcde96a2f6e651, retrieved 2026-09-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF