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Contents

README

markdown

TB4S-10

Shandong Jingdao Microelectronics · Bridge Rectifiers · ABS

TB4S-10 from Shandong Jingdao Microelectronics, in a ABS. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 + passive Output Anode (+), the rectified DC positive output of the bridge.
2 + passive Input Pin (~), AC input of the bridge rectifier.
3 3 passive Input Pin (~), AC input of the bridge rectifier.
4 - passive Output Cathode (-), the rectified DC negative output of the bridge.

Key specifications

Parameter Value
Manufacturer Shandong Jingdao Microelectronics
Package ABS
Category Diodes
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Repetitive Peak Reverse Voltage VRRM 400 V 1
Maximum RMS Voltage VRMS 280 V 1
Maximum DC Blocking Voltage VDC 400 V 1
Average Rectified Output Current IO 1 A at Tc = 125 °C 1
Peak Forward Surge Current IFSM 35 A 8.3 ms single half sine wave superimposed on rated load (JEDEC method) 1
Forward Voltage per element VF 1.1 V IF = 1.0 A 1
Maximum DC Reverse Current IR 5 μA at rated DC blocking voltage, TA = 25 °C 1
Maximum DC Reverse Current IR 50 μA at rated DC blocking voltage, TA = 100 °C 1
Maximum DC Reverse Current IR 100 μA at rated DC blocking voltage, TA = 125 °C 1
Operating and Storage Temperature Range Tj, Tstg -55 150 °C 1
Typical Thermal Resistance RθJA 72 °C/W Mounted on glass epoxy PC board with 4×1.5"×1.5" (3.81×3.81 cm) copper pad 1
Typical Thermal Resistance RθJC 20 °C/W Mounted on glass epoxy PC board with 4×1.5"×1.5" (3.81×3.81 cm) copper pad 1
Typical Junction Capacitance Cj 13 pF Measured at 1MHz and applied reverse voltage of 4 V D.C. 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing ABS Plastic surface mounted package; 4 leads ABS/LBF 3

CAD (KiCad official)

  • Symbol: TB4S-10
  • Footprint: Diode_SMD:Diode_Bridge_Diotec_ABS
  • 3D model: ABS (KiCad packages3D, STEP)
  • 3D model files: tb4s-10-etched.step / tb4s-10-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tb4s-10.step / tb4s-10.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shandong Jingdao Microelectronics datasheet (3 pp, sha256 e74f1ee0e5c2c7b3, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF