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Contents

README

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TB3100M-13-F

Diodes Incorporated · ESD And Surge Protection (TVS/ESD) · SMB

TB3100M-13-F from Diodes Incorporated, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised bidirectional ESD/TVS diode; either orientation.
2 2 passive Terminal 2 of an unpolarised bidirectional ESD/TVS diode; either orientation.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMB
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Rated Repetitive Off-State Voltage VDRM 275 V 3
Maximum Off-State Leakage Current IDRM 5 uA @ VDRM 3
Maximum Breakover Voltage VBO 350 V 3
Maximum On-State Voltage VT 3.5 V @ IT = 1A 3
Breakover Current IBO 50 800 mA 3
Holding Current IH 150 800 mA Note 4 3
Typical Off-State Capacitance CO 60 pF f = 1.0MHz, 1.0VRMS signal, VR = 2VDC bias (Note 5) 3
Non-Repetitive Peak Impulse Current Ipp 50 A @10/1000us 2
Non-Repetitive Peak On-State Current ITSM 30 A @8.3ms (one-half cycle) 2
Typical Positive Temperature Coefficient for Breakdown Voltage ΔVBR/ΔTj 0.1 %/°C 2
Junction Temperature Range TJ -40 150 °C 2
Storage Temperature Range TSTG -55 150 °C 2
Thermal Resistance, Junction to Lead RθJL 20 °C/W 2
Thermal Resistance, Junction to Ambient RθJA 100 °C/W 2
Peak Pulse Current, Surge Waveform 2/10 us Ipp 300 A 2/10 us GR-1089-CORE 2
Peak Pulse Current, Surge Waveform 8/20 us Ipp 250 A 8/20 us IEC 61000-4-5 2
Peak Pulse Current, Surge Waveform 10/160 us Ipp 150 A 10/160 us FCC Part 68 2
Peak Pulse Current, Surge Waveform 10/700 us Ipp 100 A 10/700 us ITU-T, K.20/K.21 2
Peak Pulse Current, Surge Waveform 10/560 us Ipp 75 A 10/560 us FCC Part 68 2
Peak Pulse Current, Surge Waveform 10/1000 us Ipp 50 A 10/1000 us GR-1089-CORE 2

CAD (KiCad official)

  • Symbol: TB3100M-13-F
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: tb3100m-13-f-etched.step / tb3100m-13-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tb3100m-13-f.step / tb3100m-13-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (6 pp, sha256 2dd4e1cb937f7f1e, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF