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T201625MDBDE2X

Yajingxin · Crystals · SMD2016-4P

T201625MDBDE2X from Yajingxin, in a SMD2016-4P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 XTAL1 passive Crystal terminal connected to the resonator (#1,#3 are X'tal pins; 25.000000 MHz, CL 10 pF, drive level ≤100 uW).
2 GND power_in Ground connection (#2,#4 are GND), connected to the lid/case.
3 XTAL2 passive Crystal terminal connected to the resonator (#1,#3 are X'tal pins; 25.000000 MHz, CL 10 pF, drive level ≤100 uW).
4 GND power_in Ground connection (#2,#4 are GND), connected to the lid/case.

Key specifications

Parameter Value
Manufacturer Yajingxin
Package SMD2016-4P
Category Resonators/Oscillators
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Frequency Tolerance at 25℃ -10 10 ppm at 25℃ 2
Stability over operation temperance -30 30 ppm 基准温度:25℃ 2
Aging -3 3 ppm/year 2
Shunt Capacitance (Co) Co 0 3 pF 2
Equivalent Resistance 60 Ω 2
Drive Level 100 uw 2
Insulation Resistance 500 MΩ at DC 100V 2
Operating Temperature Range -30 85 ℃ 2
Storage Temperature Range -40 85 ℃ 2
Preheat temperature (Ts) Ts 125 200 ℃ Preheat, Ts min to Ts max 3
Preheat time (ts min to ts max) ts 60 180 seconds Preheat 3
Time above 217℃ (tp) tp 60 150 seconds Time maintained above 217℃ 3
Time within 5℃ of actual peak temperature (tp) tp 20 40 seconds Time within 5℃ of actual peak 3
Peak/Classification Temperature (Tp) Tp 260 ℃ Pb-Free assembly 3
Average Ramp-up Rate (Ts max to Tp) 3 ℃/second 3
Ramp-down rate 6 ℃/second 3
Time 25℃ to Peak Temperature 8 minutes 3
Total time 200 seconds 3
Suggested reflow times 3 Times 3
Frequency (標称頻率 nominal) 25 MHZ 2
Load Capacitance (CL) CL 10 pF 2

CAD (KiCad official)

  • Symbol: T201625MDBDE2X
  • Footprint: Crystal:Crystal_SMD_2016-4Pin_2.0x1.6mm
  • 3D model: SMD2016-4P (KiCad packages3D, STEP)
  • 3D model files: t201625mdbde2x-etched.step / t201625mdbde2x-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); t201625mdbde2x.step / t201625mdbde2x.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Yajingxin datasheet (4 pp, sha256 2903f670f3b96878, retrieved 2026-10-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF