component
SZSL05T1G
Public Made by Adomby adom
onsemi TVS, SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SZSL05T1G
onsemi · TVS · SOT-23-3
SZSL05T1G from onsemi, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE | passive | Cathode of the 5.0 V VRWM surge protection diode (Style 26), connected to the protected line; VBR 6.0 V min to 8.0 V max @ 1 mA, 300 W peak power (8x20 us). |
| 2 | ANODE | passive | Anode of the surge protection diode (Style 26), connected to ground; clamps to 11 V max @ 1 A and 17 V max @ 5 A with 5.0 pF max capacitance. |
| 3 | NC | unconnected | No connection (Style 26, shown as 3 (NC) on the package diagram). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-23-3 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Working Peak Reverse Voltage | VRWM | 5 | V | SL05 | 2 | ||
| Maximum Reverse Leakage Current | IR | 20 | µA | @ VRWM | 2 | ||
| Breakdown Voltage | VBR | 6 | 8 | V | @ 1 mA, TA = 25°C | 2 | |
| Clamping Voltage @ 1 A | VC | 9.8 | V | @ 1 A, 8x20 µs waveform | 2 | ||
| Clamping Voltage @ 5 A | VC | 11 | V | @ 5 A, 8x20 µs waveform | 2 | ||
| Maximum Reverse Peak Pulse Current | IPP | 17 | A | Surge waveform per Figure 2 | 2 | ||
| Capacitance | C | 3.5 | 5 | pF | @ VR = 0 V, 1 MHz | 2 | |
| Peak Power Dissipation | Ppk | 300 | W | 8x20 µs, TL ≤ 25°C | 2 | ||
| IEC 61000-4-2 Contact Discharge | Vpp | -8 | 8 | kV | IEC 61000-4-2 Level 4 | 2 | |
| IEC 61000-4-2 Air Discharge | Vpp | -16 | 16 | kV | IEC 61000-4-2 Level 4 | 2 | |
| IEC 61000-4-4 EFT | Vpp | 40 | A | IEC 61000-4-4 | 2 | ||
| IEC 61000-4-5 Lightning | Vpp | 12 | A | IEC 61000-4-5 | 2 | ||
| Total Power Dissipation on FR-5 Board | PD | 225 | mW | TA = 25°C | 2 | ||
| Derating above 25°C (FR-5) | PD derate | 1.8 | mW/°C | Derate above 25°C, FR-5 | 2 | ||
| Thermal Resistance Junction to Ambient (FR-5) | RθJA | 556 | °C/W | FR-5 board | 2 | ||
| Total Power Dissipation on Alumina Substrate | PD | 300 | mW | TA = 25°C | 2 | ||
| Derating above 25°C (Alumina) | PD derate | 2.4 | mW/°C | Derate above 25°C, alumina | 2 | ||
| Thermal Resistance Junction-to-Ambient (Alumina) | RθJA | 417 | °C/W | Alumina substrate | 2 | ||
| Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 2 | ||
| Lead Solder Temperature - Maximum | TL | 260 | °C | 10 second duration | 2 |
CAD (KiCad official)
- Symbol:
SZSL05T1G - Footprint:
Package_TO_SOT_SMD:SOT-23-3 - 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files:
szsl05t1g-etched.step/szsl05t1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);szsl05t1g.step/szsl05t1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (6 pp, sha256
f1cb1b132892bea7, retrieved 2026-10-27, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SZSL05T1G
**onsemi** · TVS · SOT-23-3
SZSL05T1G from onsemi, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE | passive | Cathode of the 5.0 V VRWM surge protection diode (Style 26), connected to the protected line; VBR 6.0 V min to 8.0 V max @ 1 mA, 300 W peak power (8x20 us). |
| 2 | ANODE | passive | Anode of the surge protection diode (Style 26), connected to ground; clamps to 11 V max @ 1 A and 17 V max @ 5 A with 5.0 pF max capacitance. |
| 3 | NC | unconnected | No connection (Style 26, shown as 3 (NC) on the package diagram). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-23-3 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Working Peak Reverse Voltage | VRWM | | 5 | | V | SL05 | 2 |
| Maximum Reverse Leakage Current | IR | | | 20 | µA | @ VRWM | 2 |
| Breakdown Voltage | VBR | 6 | | 8 | V | @ 1 mA, TA = 25°C | 2 |
| Clamping Voltage @ 1 A | VC | | | 9.8 | V | @ 1 A, 8x20 µs waveform | 2 |
| Clamping Voltage @ 5 A | VC | | | 11 | V | @ 5 A, 8x20 µs waveform | 2 |
| Maximum Reverse Peak Pulse Current | IPP | | | 17 | A | Surge waveform per Figure 2 | 2 |
| Capacitance | C | | 3.5 | 5 | pF | @ VR = 0 V, 1 MHz | 2 |
| Peak Power Dissipation | Ppk | | | 300 | W | 8x20 µs, TL ≤ 25°C | 2 |
| IEC 61000-4-2 Contact Discharge | Vpp | -8 | | 8 | kV | IEC 61000-4-2 Level 4 | 2 |
| IEC 61000-4-2 Air Discharge | Vpp | -16 | | 16 | kV | IEC 61000-4-2 Level 4 | 2 |
| IEC 61000-4-4 EFT | Vpp | | | 40 | A | IEC 61000-4-4 | 2 |
| IEC 61000-4-5 Lightning | Vpp | | | 12 | A | IEC 61000-4-5 | 2 |
| Total Power Dissipation on FR-5 Board | PD | | | 225 | mW | TA = 25°C | 2 |
| Derating above 25°C (FR-5) | PD derate | | 1.8 | | mW/°C | Derate above 25°C, FR-5 | 2 |
| Thermal Resistance Junction to Ambient (FR-5) | RθJA | | 556 | | °C/W | FR-5 board | 2 |
| Total Power Dissipation on Alumina Substrate | PD | | | 300 | mW | TA = 25°C | 2 |
| Derating above 25°C (Alumina) | PD derate | | 2.4 | | mW/°C | Derate above 25°C, alumina | 2 |
| Thermal Resistance Junction-to-Ambient (Alumina) | RθJA | | 417 | | °C/W | Alumina substrate | 2 |
| Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 2 |
| Lead Solder Temperature - Maximum | TL | | | 260 | °C | 10 second duration | 2 |
## CAD (KiCad official)
- Symbol: `SZSL05T1G`
- Footprint: `Package_TO_SOT_SMD:SOT-23-3`
- 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files: `szsl05t1g-etched.step` / `szsl05t1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `szsl05t1g.step` / `szsl05t1g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [onsemi datasheet](https://www.onsemi.com/pdf/datasheet/szsl05t1-d.pdf) (6 pp, sha256 `f1cb1b132892bea7`, retrieved 2026-10-27, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/szsl05t1g-datasheet.pdf)