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Ray Publish 0.1.0 9ef454e 9d ago

SZP6SMB20CAT3G

Littelfuse · TVS · SMB

SZP6SMB20CAT3G from Littelfuse, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Littelfuse
Package SMB
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage (bidirectional, 20C) VBR 19 20 21 V @ IT = 1 mA; TA = 25°C (Note 7) 4
Maximum Reverse Leakage Current IR 5 µA @ VRWM 4
Peak Power Dissipation PPK 600 W TL = 25°C, Pulse Width = 1 ms, 10/1000 µs non-repetitive (Note 1) 1
DC Power Dissipation @ TL = 75°C PD 3 W Measured Zero Lead Length (Note 2) 1
DC Power Dissipation @ TA = 25°C PD 0.55 W FR-4 board, Littelfuse minimum recommended footprint (Note 3) 1
Operating and Storage Temperature Range TJ, Tstg -65 150 °C 1
Clamping Voltage @ IPP VC 27.7 V @ IPP = 22 A (Note 8) 4
Temperature coefficient of breakdown voltage 0.09 %/°C 4
Typical Junction Capacitance C 490 pF Bias Voltage = 0 V, F = 1 MHz, TJ = 25°C (Note 9) 4
Working Peak Reverse Voltage VRWM 17.1 V 4
Thermal Resistance from Junction-to-Lead RθJL 25 °C/W Measured Zero Lead Length (Note 2) 1
Derate Above 75°C (DC power, TL) 40 mW/°C Above TL = 75°C 1
Derate Above 25°C (DC power, TA) 4.4 mW/°C Above TA = 25°C 1
Thermal Resistance from Junction-to-Ambient RθJA 226 °C/W FR-4 board, Littelfuse minimum recommended footprint (Note 3) 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin and the terminal finish material is tin(Sn) (IPC/ 1

CAD (KiCad official)

  • Symbol: SZP6SMB20CAT3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: szp6smb20cat3g-etched.step / szp6smb20cat3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); szp6smb20cat3g.step / szp6smb20cat3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse datasheet (7 pp, sha256 baf561fbcd6cd66c, retrieved 2026-10-28, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF