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Contents

README

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SZNSP4201MR6T1G

onsemi · ESD Protection Devices · TSOP-6

SZNSP4201MR6T1G from onsemi, in a TSOP-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O passive Protected I/O line (uni-directional clamp to GND), VRWM 5.0 V max working voltage, clamps to 8.5 V at IPP = 1 A.
2 VN power_in Negative/ground reference pin of the surge protector; surge current return (Pin 5 to Pin 2 for the 500 W 8/20 µs rating).
3 I/O passive Protected I/O line (uni-directional clamp to GND), VRWM 5.0 V max working voltage, clamps to 8.5 V at IPP = 1 A.
4 I/O passive Protected I/O line (uni-directional clamp to GND), VRWM 5.0 V max working voltage, clamps to 8.5 V at IPP = 1 A.
5 VP passive Positive supply/rail reference pin of the surge protector; surge current is applied Pin 5 to Pin 2 for the 500 W 8/20 µs rating, connected to VCC in the application examples.
6 I/O passive Protected I/O line (uni-directional clamp to GND), VRWM 5.0 V max working voltage, clamps to 8.5 V at IPP = 1 A.

Key specifications

Parameter Value
Manufacturer onsemi
Package TSOP-6
Category TVS/Fuse/Board Level Protection
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Working Voltage VRWM 5 V Note 2 2
Breakdown Voltage VBR 6 V IT=1 mA, (Note 3) 2
Reverse Leakage Current IR 1 A VRWM = 5 V 2
Clamping Voltage VC 8.5 V IPP = 1 A, Any I/O to GND, tp = 8/20 s 2
Clamping Voltage VC 9 V IPP = 5 A, Any I/O to GND 2
Clamping Voltage VC 10 V IPP = 8 A, Any I/O to GND 2
Clamping Voltage VC 12 V IPP = 25 A, Any I/O to GND 2
Junction Capacitance I/O to GND CJ 3 5 pF VR = 0 V, f=1 MHz between I/O Pins and GND 2
Junction Capacitance I/O to I/O CJ 1.5 3 pF VR = 0 V, f=1 MHz between I/O Pins 2
Peak Power Dissipation Ppk 500 W 8/20 s @ TA = 25°C (Note 1) 1
Operating Junction Temperature Range TJ -40 125 °C 1
Storage Temperature Range Tstg -55 150 °C 1
Lead Solder Temperature TL 260 °C Maximum (10 Seconds) 1
ESD IEC 61000-4-2 Air ESD -30 30 kV IEC 61000-4-2 Air 1
ESD IEC 61000-4-2 Contact ESD -30 30 kV IEC 61000-4-2 Contact 1
EFT IEC 61000-4-4 40 A IEC 61000-4-4 (5/50 ns) EFT 1

CAD (KiCad official)

  • Symbol: SZNSP4201MR6T1G
  • Footprint: Package_SO:TSOP-6_1.65x3.05mm_P0.95mm
  • 3D model: TSOP-6 (KiCad packages3D, STEP)
  • 3D model files: sznsp4201mr6t1g-etched.step / sznsp4201mr6t1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sznsp4201mr6t1g.step / sznsp4201mr6t1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 2ef9d9abf857291f, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF