# SZNSP2201MR6T1G

**onsemi** · TVS · TSOP-6

SZNSP2201MR6T1G from onsemi, in a TSOP-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O | passive | Protected data line I/O 1 connected to the steering diodes, with 3.0 pF typical (5.0 pF max) capacitance to GND at VR = 0 V and 1 MHz. |
| 2 | VN | power_in | Negative reference (ground) pin that must be connected directly to ground using a ground plane to minimize PCB ground inductance. |
| 3 | N/C | unconnected | No connection. |
| 4 | N/C | unconnected | No connection. |
| 5 | VP | passive | Positive reference pin connected to the positive supply rail VCC (or via a recommended 10 kΩ resistor), or left unconnected to use the internal 5.0 V VRWM surge diode as the reference. |
| 6 | I/O | passive | Protected data line I/O 2 connected to the steering diodes, with 3.0 pF typical (5.0 pF max) capacitance to GND at VR = 0 V and 1 MHz. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TSOP-6 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 6 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Working Voltage | VRWM |  |  | 5 | V | Note 2 | 3 |
| Breakdown Voltage | VBR | 6 |  |  | V | IT=1 mA, (Note 3) | 3 |
| Reverse Leakage Current | IR |  |  | 1 | µA | VRWM = 5 V | 3 |
| Clamping Voltage | VC |  |  | 8.5 | V | IPP = 1 A, Any I/O to GND, tp = 8/20 µs | 3 |
| Clamping Voltage | VC |  |  | 9 | V | IPP = 5 A, Any I/O to GND, tp = 8/20 µs | 3 |
| Clamping Voltage | VC |  |  | 10 | V | IPP = 8 A, Any I/O to GND, tp = 8/20 µs | 3 |
| Clamping Voltage | VC |  |  | 12 | V | IPP = 25 A, Any I/O to GND, tp = 8/20 µs | 3 |
| Junction Capacitance I/O to GND | CJ |  | 3 | 5 | pF | VR = 0 V, f=1 MHz between I/O Pins and GND | 3 |
| Junction Capacitance I/O to I/O | CJ |  | 1.5 | 3 | pF | VR = 0 V, f=1 MHz between I/O Pins | 3 |
| Peak Power Dissipation | Ppk |  |  | 500 | W | 8/20 µs @ TA = 25°C (Note 1) | 2 |
| Operating Junction Temperature Range | TJ | -40 |  | 125 | °C |  | 2 |
| Storage Temperature Range | Tstg | -55 |  | 150 | °C |  | 2 |
| Lead Solder Temperature | TL |  |  | 260 | °C | Maximum (10 Seconds) | 2 |
| IEC 61000-4-2 Air ESD | ESD | -30 |  | 30 | kV | IEC 61000-4-2 Air | 2 |
| IEC 61000-4-2 Contact ESD | ESD | -30 |  | 30 | kV | IEC 61000-4-2 Contact | 2 |
| IEC 61000-4-4 EFT |  |  |  | 40 | A | 5/50 ns | 2 |

## CAD (KiCad official)

- Symbol: `SZNSP2201MR6T1G`
- Footprint: `Package_SO:TSOP-6_1.65x3.05mm_P0.95mm`
- 3D model: TSOP-6 (KiCad packages3D, STEP)
- 3D model files: `sznsp2201mr6t1g-etched.step` / `sznsp2201mr6t1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sznsp2201mr6t1g.step` / `sznsp2201mr6t1g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [onsemi datasheet](https://www.onsemi.com/pdf/datasheet/sznsp2201mr6t1-d.pdf) (9 pp, sha256 `55992b7babdcb93e`, retrieved 2026-10-26, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sznsp2201mr6t1g-datasheet.pdf)