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Contents

README

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SZMMBZ9V1ALT3G

onsemi · Zener Diodes · SOT-23

SZMMBZ9V1ALT3G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE 1 passive Cathode of the first Zener junction (protected line 1), used with common anode pin 3 for a unidirectional circuit, with 9.1 V nominal breakdown (8.65 V min to 9.56 V max) and 6.0 V VRWM.
2 CATHODE 2 passive Cathode of the second Zener junction (protected line 2), used with common anode pin 3 for a unidirectional circuit, with 9.1 V nominal breakdown (8.65 V min to 9.56 V max) and 6.0 V VRWM.
3 ANODE passive Common anode of both Zener junctions, normally tied to ground, and a single bidirectional configuration is possible between pins 1 and 2.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Working Peak Voltage VRWM 6 V 3
Maximum Reverse Leakage Current IR 0.3 µA @ VRWM 3
Breakdown Voltage VBR 8.65 9.1 9.56 V @ IT = 1.0 mA, TA = 25°C 3
Clamping Voltage VC 14 V @ IPP = 1.7 A 3
Maximum Reverse Peak Pulse Current IPP 1.7 A Surge waveform per Figure 6 3
Forward Voltage VF 0.9 V @ IF = 10 mA 3
Maximum Temperature Coefficient of VBR VBR 7.5 mV/°C 3
Peak Power Dissipation Ppk 24 W @ 1.0 ms, TL ≤ 25°C 2
Total Power Dissipation on FR-5 Board PD 225 mW @ TA = 25°C 2
Derating above 25°C (FR-5) PD 1.8 mW/°C Derate above 25°C, FR-5 board 2
Total Power Dissipation on Alumina Substrate PD 300 mW @ TA = 25°C 2
Derating above 25°C (Alumina) PD 2.4 mW/°C Derate above 25°C, alumina substrate 2
Junction and Storage Temperature Range TJ, Tstg -55 150 °C 2
Lead Solder Temperature - Maximum TL 260 °C 10 second duration 2
Thermal Resistance Junction-to-Ambient (FR-5) RθJA 556 °C/W FR-5 board 2
Thermal Resistance Junction-to-Ambient (Alumina) RθJA 417 °C/W Alumina substrate 2

CAD (KiCad official)

  • Symbol: SZMMBZ9V1ALT3G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: szmmbz9v1alt3g-etched.step / szmmbz9v1alt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); szmmbz9v1alt3g.step / szmmbz9v1alt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 5cb1c4fad5e02c73, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF