# SZMMBZ5V6ALT1G

**onsemi** · ESD And Surge Protection (TVS/ESD) · SOT-23

SZMMBZ5V6ALT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE 1 | passive | Cathode of the first Zener junction; with pin 3 (ANODE) it forms one unidirectional clamp, or with pins 2 and 3 it forms a single bidirectional configuration. |
| 2 | CATHODE 2 | passive | Cathode of the second Zener junction, sharing the common anode at pin 3 to protect a second separate line in the same package. |
| 3 | ANODE | passive | Common anode of both Zener junctions, connected to both cathodes (pins 1 and 2) in the dual common-anode design. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-23 |
| Category | Circuit Protection |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 5.32 | 5.6 | 5.88 | V | IT = 20 mA (Note 4) | 3 |
| Maximum Reverse Leakage Current | IR |  |  | 5 | A | @ VRWM = 3.0 V | 3 |
| Clamping Voltage | VC |  |  | 8 | V | @ IPP = 3.0 A (Note 6) | 3 |
| Maximum Reverse Peak Pulse Current | IPP |  |  | 3 | A | Surge waveform per Figure 6 (Note 6) | 3 |
| Maximum Zener Impedance | ZZT |  |  | 11 | Ω | @ IZT = 20 mA; IZ(AC) = 0.1 IZ(DC), 1.0 kHz (Note 5) | 3 |
| Maximum Zener Impedance | ZZK |  |  | 1600 | Ω | @ IZK = 0.25 mA (Note 5) | 3 |
| Forward Voltage | VF |  |  | 0.9 | V | @ IF = 10 mA | 3 |
| Maximum Temperature Coefficient of VBR | VBR |  |  | 1.26 | mV/C |  | 3 |
| Working Peak Reverse Voltage | VRWM |  | 3 |  | V |  | 3 |
| Peak Power Dissipation | Ppk |  |  | 24 | W | @ 1.0 ms (Note 1), TL ≤ 25°C | 2 |
| Total Power Dissipation on FR-5 Board | PD |  |  | 225 | mW | @ TA = 25°C (Note 2) | 2 |
| Derate above 25°C, FR-5 Board |  |  | 1.8 |  | mW/°C | Derate above 25°C (Note 2) | 2 |
| Thermal Resistance Junction-to-Ambient, FR-5 Board | RθJA |  | 556 |  | °C/W | FR-5 board (Note 2) | 2 |
| Total Power Dissipation on Alumina Substrate | PD |  |  | 300 | mW | @ TA = 25°C (Note 3) | 2 |
| Derate above 25°C, Alumina Substrate |  |  | 2.4 |  | mW/°C | Derate above 25°C (Note 3) | 2 |
| Thermal Resistance Junction-to-Ambient, Alumina Substrate | RθJA |  | 417 |  | °C/W | Alumina substrate (Note 3) | 2 |
| Junction and Storage Temperature Range | TJ, Tstg | -55 |  | 150 | °C |  | 2 |
| Lead Solder Temperature, Maximum | TL |  |  | 260 | °C | 10 second duration | 2 |

## CAD (KiCad official)

- Symbol: `SZMMBZ5V6ALT1G`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `szmmbz5v6alt1g-etched.step` / `szmmbz5v6alt1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `szmmbz5v6alt1g.step` / `szmmbz5v6alt1g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589996502073303040) (8 pp, sha256 `30678a814b33b83d`, retrieved 2026-10-20, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/szmmbz5v6alt1g-datasheet.pdf)