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SZMMBZ39VCLT1G

Public Made by Adom

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onsemi Zener Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SZMMBZ39VCLT1G

onsemi · Zener Diodes · SOT-23

SZMMBZ39VCLT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ANODE passive Anode of the first zener junction (Style 9); unidirectional circuit is tied between pins 1 and 3, with 39 V nominal breakdown (37.05 V min to 40.95 V max at 1.0 mA).
2 ANODE passive Anode of the second zener junction (Style 9); unidirectional circuit is tied between pins 2 and 3, with 39 V nominal breakdown (37.05 V min to 40.95 V max at 1.0 mA).
3 CATHODE passive Common cathode of both zener junctions; 40 W peak power at 1.0 ms (bidirectional) and 31.2 V working peak reverse voltage for the 39 V part.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage VBR 37.05 39 40.95 V @ IT = 1.0 mA, TA = 25°C 2
Working Peak Reverse Voltage VRWM 31.2 V 2
Maximum Reverse Leakage Current IR 50 nA @ VRWM 2
Clamping Voltage VC 55 V @ IPP = 0.76 A (Note 5) 2
Maximum Reverse Peak Pulse Current IPP 0.76 A Surge waveform per Figure 5 2
Forward Voltage VF 1.1 V @ IF = 200 mA 2
Maximum Temperature Coefficient of VBR VBR 35.3 mV/C 2
Peak Power Dissipation Ppk 40 Watts @ 1.0 ms, TL ≤ 25°C (Note 1) 2
Total Power Dissipation on FR-5 Board PD 225 mW @ TA = 25°C; derate 1.8 mW/°C above 25°C 2
Total Power Dissipation on Alumina Substrate PD 300 mW @ TA = 25°C; derate 2.4 mW/°C above 25°C 2
Junction and Storage Temperature Range TJ, Tstg -55 150 °C 2
Lead Solder Temperature TL 260 °C Maximum, 10 second duration 2
Thermal Resistance Junction-to-Ambient (FR-5) RθJA 556 °C/W FR-5 board 2
Thermal Resistance Junction-to-Ambient (Alumina) RθJA 417 °C/W Alumina substrate 2

CAD (KiCad official)

  • Symbol: SZMMBZ39VCLT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: szmmbz39vclt1g-etched.step / szmmbz39vclt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); szmmbz39vclt1g.step / szmmbz39vclt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 38710ac7d9de9d46, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF