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SZMMBZ15VALT3G

onsemi · Zener Diodes · SOT-23

SZMMBZ15VALT3G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE 1 passive Cathode of the first Zener junction in the dual common-anode device; it is tied to pin 3 for a unidirectional configuration, or pins 1 and 2 with pin 3 form a single bidirectional configuration.
2 CATHODE 2 passive Cathode of the second Zener junction in the dual common-anode device; it is tied to pin 3 for a unidirectional configuration (circuit tied to pins 2 and 3).
3 ANODE passive Common anode shared by both Zener junctions, used with pin 1 or pin 2 to form the unidirectional circuit.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage VBR 14.25 15 15.75 V @ IT = 1.0 mA (Note 4) 3
Maximum Reverse Leakage Current IR 50 nA @ VRWM = 12 V 3
Forward Voltage VF 0.9 V @ IF = 10 mA 3
Clamping Voltage VC 21 V @ IPP = 1.9 A (Note 6) 3
Maximum Reverse Peak Pulse Current IPP 1.9 A Note 6: surge waveform per Figure 6 and derate per Figure 7 3
Working Peak Reverse Voltage VRWM 12 V 3
Maximum Temperature Coefficient of VBR VBR 12.3 mV/C 3
Peak Power Dissipation Ppk 40 W @ 1.0 ms, TL ≤ 25°C 2
Total Power Dissipation on FR-5 Board PD 225 mW @ TA = 25°C, FR-5 board 2
Total Power Dissipation on Alumina Substrate PD 300 mW @ TA = 25°C, alumina substrate 2
Junction and Storage Temperature Range TJ, Tstg -55 150 °C 2
Lead Solder Temperature - Maximum TL 260 °C 10 second duration 2
Thermal Resistance Junction-to-Ambient RJA 556 °C/W FR-5 board 2
Thermal Resistance Junction-to-Ambient RJA 417 °C/W Alumina substrate 2

CAD (KiCad official)

  • Symbol: SZMMBZ15VALT3G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: szmmbz15valt3g-etched.step / szmmbz15valt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); szmmbz15valt3g.step / szmmbz15valt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 004905d961ae8c93, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF