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Contents

README

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SZMM3Z3V6T1GX

Nexperia · Zener Diodes · SOD-323

SZMM3Z3V6T1GX from Nexperia, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Zener diode; the marking bar on the package indicates the cathode.
2 A passive Anode of the Zener diode.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-323
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (3V6 type) VZ 3.4 3.8 V IZ = 5 mA (test current in Table 8 header) 4
Differential resistance (3V6 type) rdiff 5 Ω IZ = 5 mA 4
Temperature coefficient (3V6 type), min SZ -3.5 mV/K IZ = 5 mA 4
Temperature coefficient (3V6 type), max SZ 0 mV/K IZ = 5 mA 4
Reverse current (3V6 type), first IR column IR 1000 µA VR = 1.0 V (VR column); IZ = 0.5 mA (column header) 4
Reverse current (3V6 type), second IR column IR 90 µA VR = 1.0 V (VR column); IZ = 5 mA (column header) 4
Diode capacitance (3V6 type) Cd 390 pF f = 1 MHz; VR = 0 V 4
Series working-voltage tolerance -5 5 % Approximately ± 5 %, series-level; no per-MPN tolerance letter in datasheet 1
Forward voltage (all types) VF 0.9 V IF = 10 mA; pulse test tp ≤ 300 μs; δ ≤ 0.02 3
Forward voltage (all types) VF 1.1 V IF = 100 mA; pulse test tp ≤ 300 μs; δ ≤ 0.02 3
Forward current IF 200 mA 3
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 µs; square wave; Tamb = 25 °C; prior to surge 3
Total power dissipation Ptot 300 mW Tamb = 25 °C; device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint 3
Junction temperature Tj 150 °C 3
Ambient temperature Tamb -55 150 °C 3
Storage temperature Tstg -65 150 °C 3
Thermal resistance, junction to ambient Rth(j-a) 415 K/W in free air; FR4 PCB, single-sided copper, standard footprint 3
Thermal resistance, junction to solder point Rth(j-sp) 110 K/W soldering point of cathode tab 3

CAD (KiCad official)

  • Symbol: SZMM3Z3V6T1GX
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: szmm3z3v6t1gx-etched.step / szmm3z3v6t1gx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); szmm3z3v6t1gx.step / szmm3z3v6t1gx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (12 pp, sha256 97ec17023363288c, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF