# SZESD7351HT1G

**onsemi** · ESD And Surge Protection (TVS/ESD) · SOD-323

SZESD7351HT1G from onsemi, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode (polarity band) of the uni-directional ESD diode, connected to the protected I/O line, with 3.3 V stand-off voltage, 0.6 pF max capacitance and breakdown tested from pin 1 to 2. |
| 2 | Anode | passive | Anode of the uni-directional ESD diode, connected to ground, with IEC 61000-4-2 ±20 kV contact and air ESD protection. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 5 |  |  | V | IT = 1 mA | 2 |
| Reverse Leakage Current | IR |  | 1 | 50 | nA | VRWM = 3.3 V | 2 |
| Clamping Voltage | VC |  |  | 8 | V | IPP = 1 A | 2 |
| Clamping Voltage | VC |  |  | 10 | V | IPP = 3 A | 2 |
| Junction Capacitance | CJ |  | 0.43 | 0.6 | pF | VR = 0 V, f = 1 MHz | 2 |
| IEC 61000-4-2 ESD Contact |  | -20 |  | 20 | kV | Contact | 1 |
| IEC 61000-4-2 ESD Air |  | -20 |  | 20 | kV | Air | 1 |
| Total Power Dissipation on FR-5 Board | PD |  |  | 150 | mW | TA = 25°C | 1 |
| Junction and Storage Temperature Range | TJ, Tstg | -55 |  | 150 | °C |  | 1 |
| Lead Solder Temperature | TL |  |  | 260 | °C | 10 Second Duration | 1 |
| Reverse Working Voltage | VRWM |  | 3.3 |  | V |  | 2 |
| Dynamic Resistance | RDYN |  | 0.35 |  | Ω | TLP Pulse | 2 |

## CAD (KiCad official)

- Symbol: `SZESD7351HT1G`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `szesd7351ht1g-etched.step` / `szesd7351ht1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `szesd7351ht1g.step` / `szesd7351ht1g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589997028311654400) (9 pp, sha256 `9ba1b22b232b0a0a`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/szesd7351ht1g-datasheet.pdf)