# SZESD5Z6.0T5G

**onsemi** · ESD And Surge Protection (TVS/ESD) · SOD-523

SZESD5Z6.0T5G from onsemi, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE | passive | Cathode pin, marked by the polarity band on the SOD-523 package, connected to the ESD protection diode per Style 1 of the case outline. |
| 2 | ANODE | passive | Anode pin of the uni-directional ESD protection diode, rated for a working peak reverse voltage (VRWM) of 6.0 V for the ESD5Z6.0T1G/T5G device. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOD-523 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Reverse Leakage Current @ VRWM | IR |  |  | 0.01 | A | @ VRWM | 3 |
| Breakdown Voltage @ IT | VBR | 6.8 |  |  | V | @ IT = 1.0 mA (Note 2) | 3 |
| Clamping Voltage @ IPP = 5.0 A | VC |  |  | 12.4 | V | @ IPP = 5.0 A (surge per Figure 5) | 3 |
| Clamping Voltage @ Max IPP | VC |  |  | 20.5 | V | @ Max IPP (surge per Figure 5) | 3 |
| Maximum Reverse Peak Pulse Current | IPP |  |  | 8.8 | A | surge per Figure 5 | 3 |
| Peak Power Dissipation | Ppk |  |  | 181 | W | surge per Figure 5 | 3 |
| Max. Capacitance | C |  |  | 70 | pF | @ VR = 0 and f = 1 MHz | 3 |
| Working Peak Reverse Voltage | VRWM |  |  | 6 | V |  | 3 |
| IEC 61000-4-2 (ESD) Contact |  | -30 |  | 30 | kV | contact | 2 |
| IEC 61000-4-2 (ESD) Air |  | -30 |  | 30 | kV | air | 2 |
| IEC 61000-4-4 (EFT) |  |  |  | 40 | A |  | 2 |
| ESD Voltage Per Human Body Model |  |  |  | 16 | kV | per Human Body Model | 2 |
| ESD Voltage Per Machine Model |  |  |  | 400 | V | per Machine Model | 2 |
| Total Power Dissipation on FR-4 Board | PD |  |  | 500 | mW | TA = 25°C (Note 1) | 2 |
| Junction and Storage Temperature Range | TJ, Tstg | -55 |  | 150 | °C |  | 2 |
| Lead Solder Temperature - Maximum | TL |  |  | 260 | °C | 10 second duration | 2 |

## CAD (KiCad official)

- Symbol: `SZESD5Z6.0T5G`
- Footprint: `Diode_SMD:D_SOD-523`
- 3D model: SOD-523 (KiCad packages3D, STEP)
- 3D model files: `szesd5z6-0t5g-etched.step` / `szesd5z6-0t5g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `szesd5z6-0t5g.step` / `szesd5z6-0t5g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589989167825653760) (6 pp, sha256 `56ee5fd48804e547`, retrieved 2026-10-15, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/szesd5z6-0t5g-datasheet.pdf)