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Ray Publish 0.1.0 143f06e 10d ago

SZ1SMB5936BT3G

onsemi · Zener Diodes · SMB

SZ1SMB5936BT3G from onsemi, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage @ IZT VZ 28.5 30 31.5 V @ IZT = 12.5 mA; TL = 30°C unless otherwise noted 3
Zener voltage tolerance (type number designation) -5 5 % Note 2: type numbers indicate a tolerance of ±5% 3
Maximum Zener Impedance @ IZT ZZT 28 Ω @ IZT = 12.5 mA; IZ(ac) = 0.1 IZ(dc), 60 Hz; TL = 30°C unless otherwise noted 3
Maximum Zener Impedance @ IZK ZZK 750 Ω @ IZK = 0.25 mA; IZ(ac) = 0.1 IZ(dc), 60 Hz; TL = 30°C unless otherwise noted 3
Reverse Leakage Current @ VR IR 1 µA @ VR = 22.8 V; TL = 30°C unless otherwise noted 3
Maximum DC Zener Current IZM 50 mA TL = 30°C unless otherwise noted 3
Forward Voltage @ IF VF 1.5 V @ IF = 200 mA(dc) for all types 3
Maximum Steady State Power Dissipation @ TL = 75°C PD 3 W TL = 75°C; measured at zero lead length 1
Maximum Steady State Power Dissipation @ TA = 25°C PD 550 mW TA = 25°C; FR-4 board, recommended footprint (Note 1) 1
Thermal Resistance from Junction-to-Ambient RJA 226 °C/W Junction-to-Ambient; FR-4 board, recommended footprint (Note 1) 1
Thermal Resistance from Junction-to-Lead RJL 40 °C/W Junction-to-Lead; measured at zero lead length 1
Operating and Storage Temperature Range TJ, Tstg -65 150 °C 1
Derate Above 75°C (steady state power) 25 mW/°C Derate above TL = 75°C 1
Derate Above 25°C (steady state power) 4.4 mW/°C Derate above TA = 25°C 1

CAD (KiCad official)

  • Symbol: SZ1SMB5936BT3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: sz1smb5936bt3g-etched.step / sz1smb5936bt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sz1smb5936bt3g.step / sz1smb5936bt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 b2ddba7d745c56c9, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF