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Contents

README

markdown

SZ1SMB5931BT3G-VF01

onsemi · Zener Diodes · SMB

SZ1SMB5931BT3G-VF01 from onsemi, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage VZ 17.1 18 18.9 V @ IZT = 20.8 mA; TL = 30°C unless otherwise noted 3
Type number tolerance -5 5 % Type number designation indicates ±5% (Note 2) 3
Forward Voltage VF 1.5 V @ IF = 200 mA(dc), for all types 3
Maximum Zener Impedance ZZT 12 Ω @ IZT = 20.8 mA; AC 0.1 IZ(dc), 60 Hz (Note 4) 3
Maximum Zener Impedance ZZK 650 Ω @ IZK = 0.25 mA; AC 0.1 IZ(dc), 60 Hz (Note 4) 3
Reverse Leakage Current IR 1 µA @ VR = 13.7 V 3
Maximum DC Zener Current IZM 83 mA 3
Steady State Power Dissipation PD 3 W @ TL = 75°C; measured at zero lead length 1
Steady State Power Dissipation PD 550 mW @ TA = 25°C; FR-4 board, recommended footprint (Note 1) 1
Operating and Storage Temperature Range TJ, Tstg -65 150 °C 1
Derate Above 75°C 25 mW/°C Above TL = 75°C 1
Thermal Resistance Junction-to-Lead RJL 40 °C/W Junction-to-lead 1
Derate Above 25°C 4.4 mW/°C Above TA = 25°C 1
Thermal Resistance Junction-to-Ambient RJA 226 °C/W Junction-to-ambient, FR-4 board (Note 1) 1

CAD (KiCad official)

  • Symbol: SZ1SMB5931BT3G-VF01
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: sz1smb5931bt3g-vf01-etched.step / sz1smb5931bt3g-vf01-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sz1smb5931bt3g-vf01.step / sz1smb5931bt3g-vf01.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 be14f2f5f44a9094, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF