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SZ1SMB5918BT3G

onsemi · Zener Diodes · SMB

SZ1SMB5918BT3G from onsemi, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage (nominal 5.1 V, ±5%) VZ 4.84 5.1 5.36 V @ IZT = 73.5 mA; TL = 30°C unless otherwise noted 3
Zener voltage tolerance (type number designation) -5 5 % Type numbers indicate ±5% tolerance 3
Maximum Zener impedance ZZT 4 Ω @ IZT; AC 0.1 IZ(dc) at 60 Hz 3
Maximum Zener impedance ZZK 350 Ω @ IZK; AC 0.1 IZ(dc) at 60 Hz 3
Maximum DC Zener current IZM 294 mA(dc) 3
Maximum steady state power dissipation PD 3 W @ TL = 75°C; measured at zero lead length 1
Maximum steady state power dissipation PD 550 mW @ TA = 25°C; FR-4 board, recommended footprint (Note 1) 1
Operating and storage temperature range TJ, Tstg -65 150 °C 1
Zener test current IZT 73.5 mA Test current for VZ and ZZT 3
Zener test current at knee IZK 1 mA Test current for ZZK 3
Reverse leakage current IR 5 A @ VR = 2 V 3
Reverse voltage (leakage test) VR 2 V Test voltage for IR 3
Power derating above TL = 75°C PD 25 mW/°C Derate above 75°C 1
Power derating above TA = 25°C PD 4.4 mW/°C Derate above 25°C 1
Thermal resistance, junction-to-lead RJL 40 °C/W Measured at zero lead length 1
Thermal resistance, junction-to-ambient RJA 226 °C/W FR-4 board, recommended footprint (Note 1) 1

CAD (KiCad official)

  • Symbol: SZ1SMB5918BT3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: sz1smb5918bt3g-etched.step / sz1smb5918bt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sz1smb5918bt3g.step / sz1smb5918bt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 a7347185b46458b7, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF