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SZ1SMB26AT3G

Littelfuse · TVS · SMB

SZ1SMB26AT3G from Littelfuse, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode of the uni-directional TVS diode (color band side), connected to the protected positive line; VRWM 26 V, VBR 28.9-31.9 V at 1.0 mA, VC 42.1 V at 14.2 A.
2 Anode passive Anode of the uni-directional TVS diode, normally connected to ground/return, with the cathode marked by a color band.

Key specifications

Parameter Value
Manufacturer Littelfuse
Package SMB
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working Peak Reverse Voltage VRWM 26 V 3
Breakdown Voltage VBR 28.9 30.4 31.9 V @ IT = 1.0 mA 3
Maximum Reverse Leakage Current IR 5 µA @ VRWM 3
Clamping Voltage VC 42.1 V @ IPP = 14.2 A 3
Maximum Reverse Peak Pulse Current IPP 14.2 A 3
Forward Voltage VF 3.5 V IF = 30 A, TA = 25°C, Uni-directional 2
Typical Capacitance C 630 pF Bias Voltage = 0 V, F = 1 MHz, TJ = 25°C 3
Peak Power Dissipation PPK 600 W TL = 25°C, Pulse Width = 1 ms (10/1000 µs, non-repetitive) 1
DC Power Dissipation PD 3 W TL = 75°C, zero lead length 1
DC Power Dissipation PD 0.55 W TA = 25°C, FR-4 board, minimum recommended footprint 1
Forward Surge Current IFSM 100 A TA = 25°C, 1/2 sine wave PW = 8.3 ms, Uni-directional only 1
Operating and Storage Temperature Range TJ, Tstg -65 150 °C 1
Thermal Resistance Junction-to-Lead RθJL 25 °C/W 1
Thermal Resistance Junction-to-Ambient RθJA 226 °C/W 1
Derating above 75°C 40 mW/°C Above TL = 75°C 1
Derating above 25°C 4.4 mW/°C Above TA = 25°C 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin and the terminal finish material is tin(Sn) (IPC/ 1

CAD (KiCad official)

  • Symbol: SZ1SMB26AT3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: sz1smb26at3g-etched.step / sz1smb26at3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sz1smb26at3g.step / sz1smb26at3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse datasheet (7 pp, sha256 b867ff8d1ae59140, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF