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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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SZ1SMB13AT3G

Littelfuse · ESD And Surge Protection (TVS/ESD) · SMB

SZ1SMB13AT3G from Littelfuse, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode of the uni-directional TVS, marked by the color band on the package; this device has a working peak reverse voltage (VRWM) of 13 V.
2 Anode passive Anode of the uni-directional TVS, the terminal opposite the color band; forward voltage is 3.5 V max at 30 A forward current (Note 5).

Key specifications

Parameter Value
Manufacturer Littelfuse
Package SMB
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage (uni-directional, part SZ1SMB13AT3G) VBR 14.4 15.15 15.9 V @ IT = 1.0 mA; Note 7: VBR measured at pulse test current IT at 25°C 3
Maximum reverse leakage current IR 5 µA @ VRWM = 13 V 3
Peak pulse power dissipation PPK 600 W @ TL = 25°C, pulse width = 1 ms (Note 1: 10/1000 µs, non-repetitive) 1
DC power dissipation, lead-measured PD 3 W @ TL = 75°C, measured zero lead length (Note 2: 1” square copper pad, FR-4) 1
DC power dissipation, ambient PD 0.55 W @ TA = 25°C (Note 3: FR-4, Littelfuse minimum recommended footprint) 1
Forward surge current (unidirectional only) IFSM 100 A @ TA = 25°C; 1/2 sine wave, PW = 8.3 ms, max 4 pulses per minute (Note 4) 1
Operating and storage temperature range TJ, Tstg -65 150 °C Operating junction and storage temperature 1
Clamping voltage VC 21.5 V @ IPP = 27.9 A (Note 8: surge waveform per Figure 1, derate per Figure 3) 3
Derate above 75°C (DC power, lead-measured) 40 mW/°C 1
Derate above 25°C (DC power, ambient) 4.4 mW/°C 1
Thermal resistance, junction-to-lead RƟJL 25 °C/W Note 2: 1” square copper pad, FR-4 board 1
Thermal resistance, junction-to-ambient RƟJA 226 °C/W Note 3: FR-4 board, Littelfuse minimum recommended footprint 1

CAD (KiCad official)

  • Symbol: SZ1SMB13AT3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: sz1smb13at3g-etched.step / sz1smb13at3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sz1smb13at3g.step / sz1smb13at3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse datasheet (7 pp, sha256 b867ff8d1ae59140, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF