Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

SZ1SMA20AT3G

Littelfuse · TVS · SMA

SZ1SMA20AT3G from Littelfuse, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE passive Cathode (polarity band) of the unidirectional TVS; connect to the protected positive line, with VRWM 20 V, VBR 22.2 V min to 24.5 V max at 1 mA, and VC 32.4 V at 12.3 A.
2 ANODE passive Anode of the unidirectional TVS; connect to the return/ground side of the protected line (the datasheet lists it as Pin 2, Style 1).

Key specifications

Parameter Value
Manufacturer Littelfuse
Package SMA
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage VBR 22.2 23.35 24.5 V @ IT = 1 mA, TA = 25°C 3
Working Peak Reverse Voltage VRWM 20 V 3
Maximum Reverse Leakage Current IR 2.5 µA @ VRWM 3
Clamping Voltage VC 32.4 V @ IPP = 12.3 A 3
Maximum Reverse Peak Pulse Current IPP 12.3 A Surge waveform per Figure 2 3
Forward Voltage VF 3.5 V @ IF = 30 A, all types 2
Peak Power Dissipation PPK 400 W TL = 25°C, Pulse Width = 1 ms 1
DC Power Dissipation (lead) PD 1 W TL = 75°C, zero lead length, 1" square copper pad FR-4 1
DC Power Dissipation (ambient) PD 0.5 W TA = 25°C, FR-4 board, min recommended footprint 1
Forward Surge Current IFSM 40 A TA = 25°C, 1/2 sine wave, PW = 8.3 ms 1
Operating and Storage Temperature Range TJ, Tstg -65 150 °C 1
Thermal Resistance Junction-to-Lead RJL 50 °C/W 1
Thermal Resistance Junction-to-Ambient R0JA 250 °C/W FR-4 board, min recommended footprint 1
Derating above 75°C 20 mW/°C Above TL = 75°C 1
Derating above 25°C 4 mW/°C Above TA = 25°C 1
Junction Capacitance C 585 pF Bias voltage = 0 V, F = 1.0 MHz, TJ = 25°C 3
Test Current IT 1 mA VBR measurement 3

CAD (KiCad official)

  • Symbol: SZ1SMA20AT3G
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA (KiCad packages3D, STEP)
  • 3D model files: sz1sma20at3g-etched.step / sz1sma20at3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sz1sma20at3g.step / sz1sma20at3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse datasheet (5 pp, sha256 0efc269c31859c3d, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF