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Ray Publish 0.1.0 9da2b61 17d ago

SZ1SMA170AT3G

Littelfuse · ESD And Surge Protection (TVS/ESD) · DO-214AC(SMA)

SZ1SMA170AT3G from Littelfuse, in a DO-214AC(SMA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode of the uni-directional TVS, identified by the color band on the package; the device is rated for a working peak reverse voltage (VRWM) of 170 V and 400 W peak pulse power.
2 Anode passive Anode of the uni-directional TVS; at VRWM 170 V the maximum reverse leakage is 2.5 µA, and the clamping voltage is 275 V at a peak pulse current of 1.5 A.

Key specifications

Parameter Value
Manufacturer Littelfuse
Package DO-214AC(SMA)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Power Dissipation PPK 400 W TL = 25°C, Pulse Width = 1 ms (note 1: 10 X 1000 µs, non-repetitive) 1
DC Power Dissipation @ TL = 75°C PD 1.5 W Measured zero lead length (note 2) 1
DC Power Dissipation @ TA = 25°C PD 0.5 W FR-4 board, Littelfuse minimum recommended footprint (note 3) 1
Forward Surge Current IFSM 40 A TA = 25°C, for uni-directional (note 4: 1/2 sine wave, PW = 8.3 ms) 1
Operating and Storage Temperature Range TJ, Tstg -65 150 °C 1
Breakdown Voltage VBR 189 199 209 V @ IT = 1 mA (note 7), TA = 25°C 3
Maximum Reverse Leakage Current IR 2.5 µA @ VRWM = 170 V 3
Forward Voltage VF 3.5 V @ IF = 30 A, all types (note 5) 2
Clamping Voltage VC 275 V @ IPP = 1.5 A (note 8: surge waveform per Figure 2) 3
Junction Capacitance C 112 pF Bias voltage = 0 V, F = 1.0 MHz, TJ = 25°C (note 9) 3
Working Peak Reverse Voltage VRWM 170 V Note 6: should be equal to or greater than DC or continuous peak operating voltage 3
Thermal Resistance from Junction-to-Lead RθJL 50 °C/W Measured zero lead length, 1 in square copper pad, FR-4 (note 2) 1
Thermal Resistance from Junction-to-Ambient RθJA 250 °C/W FR-4 board, minimum recommended footprint (note 3) 1
DC Power Derating above 75°C PD 20 mW/°C Derate above TL = 75°C 1
DC Power Derating above 25°C PD 4 mW/°C Derate above TA = 25°C 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin and the terminal finish material is tin(Sn) (IPC/ 1

CAD (KiCad official)

  • Symbol: SZ1SMA170AT3G
  • Footprint: Diode_SMD:D_SMA
  • 3D model: DO-214AC(SMA) (KiCad packages3D, STEP)
  • 3D model files: sz1sma170at3g-etched.step / sz1sma170at3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sz1sma170at3g.step / sz1sma170at3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse datasheet (7 pp, sha256 2dcbd1b5c6bf6a05, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF