# SYSD03C

**SY(顺烨)** · IC · SOD-323

SYSD03C from SY(顺烨), in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Bidirectional TVS terminal 1 (I/O line to be protected, interchangeable with the other terminal), 3.3V max working voltage (VRWM), 4.0V min breakdown at 1mA. |
| 2 | A2 | passive | Bidirectional TVS terminal 2 (interchangeable with the other terminal, typically ground/return), 350W peak pulse power (8/20μs), ±30kV ESD contact and air. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | SY(顺烨) |
| Package | SOD-323 |
| Category |  |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Working Voltage | VRWM |  |  | 3.3 | V |  | 2 |
| Breakdown Voltage | VB | 4 |  |  | V | IT=1 mA | 2 |
| Clamping Voltage @1A | VC@1A |  |  | 7.5 | V | IPP=1 A | 2 |
| Clamping Voltage | VC |  |  | 16 | V | 20 A | 2 |
| Reverse Leakage Current | IR |  |  | 40 | µA |  | 2 |
| Capacitance | CT |  |  | 450 | pF |  | 2 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 |  | 30 | kV | Contact | 2 |
| ESD per IEC 61000-4-2 (Air) | VESD | -30 |  | 30 | kV | Air | 2 |
| Peak Pulse Power | PPP |  |  | 350 | W | 8/20μs | 2 |
| Operating Temperature | TOPT | -55 |  | 150 | C |  | 2 |
| Storage Temperature | TSTG | -55 |  | 150 | C |  | 2 |
| Lead Soldering Temperature | TL |  |  | 260 | C | 10 sec. | 2 |
| Test Current | IT |  | 1 |  | mA |  | 2 |

## CAD (KiCad official)

- Symbol: `SYSD03C`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `sysd03c-etched.step` / `sysd03c-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sysd03c.step` / `sysd03c.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [SY(顺烨) datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590906632161882112) (3 pp, sha256 `1151052aeba85d2b`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sysd03c-datasheet.pdf)