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Contents

README

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SY89327LMG-TR

Microchip Tech · Translators / Level Shifters · MLF-8

SY89327LMG-TR from Microchip Tech, in a MLF-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connect.
2 IN input Differential signal input that accepts AC- or DC-coupled signals as small as 100mV; external termination is required.
3 /IN input Complement of the differential signal input that accepts AC- or DC-coupled signals as small as 100mV; external termination is required.
4 NC unconnected No connect.
5 GND power_in Ground pin; the ground pin and exposed pad must be connected to the same ground plane.
6 /Q output Complement differential LVPECL output, which must be terminated with 50Ω to VCC-2V.
7 Q output True differential LVPECL output (100k temperature-compensated LVPECL compatible), which must be terminated with 50Ω to VCC-2V.
8 VCC power_in Positive power supply, 3.0V to 3.6V per the operating ratings; bypass with 0.1µF
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package MLF-8
Category Logic ICs
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (VCC), operating range VCC 3 3.6 V Operating Ratings 3
Ambient Temperature (TA), operating range TA -40 85 °C Operating Ratings 3
Power Supply Voltage VCC 3 3.3 3.6 V TA = -40°C to +85°C; unless stated 3
Power Supply Current ICC 28 45 mA No load, max. VCC 3
Output Voltage Swing (single-ended) VOUT 550 800 mV See Figure 2a 3
Differential Output Voltage Swing VDIFF-OUT 1100 1600 mVPP See Figure 2b 3
Input Voltage Swing VIN 100 mV See Figure 2a, VIH < 2.4V 3
Input Voltage Swing VIN 200 mV See Figure 2a, VIH < VCC +0.3V 3
Maximum Operating Frequency (NRZ Data) fMAX 2.5 Gbps NRZ Data 4
Maximum Operating Frequency (Clock) fMAX 2.5 GHz VOUT ≥ 200mV Clock 4
Propagation Delay IN-to-Q, /IN-to-/Q tpd 400 ps VIN ≥ 100mV 4
RMS Phase Jitter tJITTER 75 fs RMS Output = 622MHz; Integration Range: 12kHz - 20MHz 4
Rise / Fall Time (20% to 80%) tr, tf 200 ps At full output swing; Q, /Q 4
Supply Voltage (VCC), absolute maximum VCC -0.5 4 V 3
Input Current, source or sink on IN, /IN -50 50 mA 3
Input Voltage (VIN), absolute minimum VIN -0.5 V 3
Lead Temperature (soldering) 260 °C soldering, 20 sec. 3
Storage Temperature TS -65 150 °C 3
Package Thermal Resistance, Junction-to-Ambient (QFN) ΘJA 87 °C/W 500lfpm 3
Package Thermal Resistance, Junction-to-Board (QFN) ΨJB 32 °C/W Junction-to-Board 3

CAD (KiCad official)

  • Symbol: SY89327LMG-TR
  • Footprint: Package_DFN_QFN:MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm
  • 3D model: MLF-8 (KiCad packages3D, STEP)
  • 3D model files: sy89327lmg-tr-etched.step / sy89327lmg-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sy89327lmg-tr.step / sy89327lmg-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (8 pp, sha256 c1f3a03aca3a6b62, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF