# SY89323LMG-TR

**Microchip Tech** · Translators / Level Shifters · MLF-8

SY89323LMG-TR from Microchip Tech, in a MLF-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN0 | input | Differential PECL/ECL input with an internal 75kΩ pull-down resistor; if left open the pin defaults LOW and the Q output will be LOW. |
| 2 | /IN0 | input | Complementary differential PECL/ECL input with internal 75kΩ pull-up and pull-down resistors; if left floating it defaults to VCC/2 and may be left open when not used. |
| 3 | /IN1 | input | Complementary differential PECL/ECL input with internal 75kΩ pull-up and pull-down resistors; if left floating it defaults to VCC/2 and may be left open when not used. |
| 4 | IN1 | input | Differential PECL/ECL input with an internal 75kΩ pull-down resistor; if left open the pin defaults LOW and the Q output will be LOW. |
| 5 | GND | power_in | Ground pin; GND and the exposed pad must be tied to the ground plane. |
| 6 | Q1 | output | Single-ended LVTTL output that defaults to LOW if the IN inputs are left open. |
| 7 | Q0 | output | Single-ended LVTTL output that defaults to LOW if the IN inputs are left open. |
| 8 | VCC | power_in | Positive power supply; bypass with 0.1µF//0.01µF low ESR capacitors. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | MLF-8 |
| Category | Logic ICs |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage (VCC) | VCC | -0.5 |  | 3.8 | V |  | 3 |
| Input Voltage (VIN) | VIN | -0.5 |  |  | V |  | 3 |
| LVPECL Output Current (IOUT) Continuous | IOUT |  |  | 50 | mA | Continuous | 3 |
| LVPECL Output Current (IOUT) Surge | IOUT |  |  | 100 | mA | Surge | 3 |
| Input Current, source or sink on IN, /IN |  | -50 |  | 50 | mA | Source or sink current on IN, /IN | 3 |
| Lead Temperature (soldering) |  |  |  | 260 | °C | soldering, 20 sec. | 3 |
| Storage Temperature (TS) | TS | -65 |  | 150 | °C |  | 3 |
| Supply Voltage (VCC) operating | VCC | 3 |  | 3.6 | V |  | 3 |
| Ambient Temperature (TA) | TA | -40 |  | 85 | °C |  | 3 |
| Output HIGH Voltage | VOH | 2 |  |  | V | IOH = -3.0mA | 3 |
| Output LOW Voltage | VOL |  |  | 0.5 | V | IOL = 24mA | 3 |
| Power Supply Current | ICC |  |  | 30 | mA |  | 3 |
| Output Short Circuit Current | IOS | -80 |  | -240 | mA | VOUT = 0V | 3 |
| Minimum Peak-to-Peak Input | VPP | 200 |  |  | mV |  | 3 |
| Input HIGH Current | IIH |  |  | 150 | µA |  | 3 |
| Input LOW Current (IN) | IIL | 0.5 |  |  | µA | IN | 3 |
| Input LOW Current (/IN) | IIL | -300 |  |  | µA | /IN | 3 |
| Maximum Input Frequency | fMAX | 275 |  |  | MHz | Notes 1, 2 | 4 |
| Propagation Delay | tpd | 1.5 |  | 2.5 | ns |  | 4 |
| Part-to-Part Skew | tskpp |  |  | 0.5 | ns | Notes 3 | 4 |
| Within-Device Skew (HIGH-to-HIGH) | tskew++ |  |  | 0.3 | ns | Notes 4 | 4 |
| Within-Device Skew (LOW-to-LOW) | tskew-, |  |  | 0.3 | ns | Notes 5 | 4 |
| Cycle-to-Cycle Jitter | tjitter |  |  | 2 | psRMS | Note 6 | 4 |
| Total Jitter |  |  |  | 25 | psPP | Note 7 | 4 |
| Output Rise/Fall Time | tr | 0.5 |  | 1 | ns | 1.0V to 2.0V | 4 |
| Thermal Resistance, Junction-to-Ambient (still air) | θJA |  | 93 |  | °C/W | Still-Air | 3 |
| Thermal Resistance, Junction-to-Ambient (500 lfpm) | θJA |  | 87 |  | °C/W | 500lfpm | 3 |
| Thermal Resistance, Junction-to-Board | ΨJB |  | 60 |  | °C/W | Junction-to-Board | 3 |

## CAD (KiCad official)

- Symbol: `SY89323LMG-TR`
- Footprint: `Package_DFN_QFN:MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm`
- 3D model: MLF-8 (KiCad packages3D, STEP)
- 3D model files: `sy89323lmg-tr-etched.step` / `sy89323lmg-tr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sy89323lmg-tr.step` / `sy89323lmg-tr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Microchip Tech datasheet](docs/sy89323lmg-tr-datasheet.pdf) (5 pp, sha256 `d9dbdc29b0232d27`, retrieved 2026-10-31, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sy89323lmg-tr-datasheet.pdf)