SY8029AIC from Silergy Corp, in a TSOT-23-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	FB1	input	Feedback pin for output1; connect it to the center point of the output resistor divider to program VOUT1 = 0.6V*(1+RH1/RL1).
2	IN	power_in	Power input pin; decouple it to ground with at least 10uF ceramic capacitance. The input supply range is 2.5V to 5.5V.
3	LX1	output	Inductor pin for output1; connect it to the switching node of the output1 inductor.
4	GND	power_in	Ground pins.
5	LX2	output	Inductor pin for output2; connect it to the switching node of the output2 inductor.
6	EN2	input	Enable pin for output2; do not leave it floating.
7	EN1	input	Enable pin for output1; do not leave it floating.
8	FB2	input	Feedback pin for output2; connect it to the center point of the output resistor divider to program VOUT2 = 0.6V*(1+RH2/RL2).

Key specifications

Parameter	Value
Manufacturer	Silergy Corp
Package	TSOT-23-8
Category	Power Management ICs
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Input Voltage Range	VIN	2.5		5.5	V		3
Shutdown Current	ISHDN		0.1	1	µA	EN1=EN2=0	3
Quiescent Current	IQ			35	µA	EN1=1 or EN2=1, IOUT1= IOUT1=0, no switching	3
Quiescent Current	IQ			45	µA	EN1=1 and EN2=1, IOUT1= IOUT2=0, no switching	3
Feedback Reference Voltage	VREF1, VREF2	0.588	0.6	0.612	V		3
Supply Input Voltage	VIN	2.5		5.5	V		2
Power Dissipation	PD			1.7	W	TA = 25°C, TSOT23-8	2
Junction Temperature Range				150	°C		2
Lead Temperature (Soldering)				260	°C	Soldering, 10 sec.	2
Storage Temperature Range				150	°C		2
Junction Temperature Range				125	°C		2
Ambient Temperature Range				85	°C		2
Input UVLO Threshold	VUVLO		2.5		V		3
UVLO Hysteresis	VHYS1		0.2		V		3
Oscillator Frequency	fOSC		2		MHz	IOUT1 = 0.1A, IOUT2 = 0.1A	3
Thermal Shutdown Temperature	TSD		150		°C		3
Thermal Shutdown Hysteresis	THYS		20		°C		3
PFET RON	RDS(ON),P1, RDS(ON),P2		125		mΩ		3
NFET RON	RDS(ON),N1, RDS(ON),N2		100		mΩ		3
PFET Current Limit	ILIM1, ILIM2		2.8		A		3
EN Rising Threshold	VENH1, VENH2		1.2		V		3
EN Falling Threshold	VENL1, VENL2		0.4		V		3
Internal Soft Start Time	tSS1, tSS2		1		ms		3
Package Thermal Resistance junction-to-ambient	θJA		60		°C/W	Natural convection at TA = 25°C, JEDEC 51-3 low effective single layer board	2
Package Thermal Resistance junction-to-case	θJC		15		°C/W		2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts	copper		enhance the soldering quality and thermal performance. 2) Input cap must be close to Pins IN and GND. The loop area formed by input cap ， IN, GND must be minimized. 3) The PCB copper area associated w	7

CAD (KiCad official)

Symbol: SY8029AIC
Footprint: Package_TO_SOT_SMD:TSOT-23-8
3D model: TSOT-23-8 (KiCad packages3D, STEP)
3D model files: sy8029aic-etched.step / sy8029aic-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sy8029aic.step / sy8029aic.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Silergy Corp datasheet (9 pp, sha256 fbf59f059404a3a1, retrieved 2026-11-05, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

SY8029AIC

Verified SY8029AIC

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README