component
SY6874DBC
Public Made by Adomby adom
Silergy Corp Power Distribution Switches, DFN-10-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSY6874DBC
Silergy Corp · Power Distribution Switches · DFN-10-EP(3x3)
SY6874DBC from Silergy Corp, in a DFN-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Power input pin; decouple high-frequency noise by connecting at least 0.1uF MLCC to ground. |
| 2 | IN | power_in | Power input pin; decouple high-frequency noise by connecting at least 0.1uF MLCC to ground. |
| 3 | IN | power_in | Power input pin; decouple high-frequency noise by connecting at least 0.1uF MLCC to ground. |
| 4 | VCP | passive | Output clamp voltage selection based on input voltage: a resistor to IN selects High (3.3V/5V/12V mode per table), a resistor to ground selects Low, or floating selects Open; recommended decoupling with 0.1uF capacitor. |
| 5 | ILIM | passive | Current limit program pin; program the current limit by connecting a resistor to ground. |
| 6 | SST | passive | Soft-start time program pin; connect a capacitor to ground to program the soft-start time. |
| 7 | EN | input | Enable interface pin; pull it high to enable the IC. |
| 8 | OUT | power_out | Power output pin. |
| 9 | OUT | power_out | Power output pin. |
| 10 | OUT | power_out | Power output pin. |
| 11 | GND | power_in | Ground pin; this is the exposed paddle of the DFN package. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Silergy Corp |
| Package | DFN-10-EP(3x3) |
| Category | Power Management (PMIC) |
| Pins | 11 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Input Voltage | 30 | V | 3 | ||||
| EN pin, VCP pin | 30 | V | 3 | ||||
| Power Dissipation DFN3X3-10 | PD | 2.6 | W | TA = 25°C | 3 | ||
| Junction Temperature Range | 125 | °C | 3 | ||||
| Lead Temperature (Soldering) | 260 | °C | Soldering, 10 sec. | 3 | |||
| Storage Temperature Range | -65 | 150 | °C | 3 | |||
| Thermal Resistance Junction-to-Ambient | θJA | 38 | °C/W | Natural convection, TA = 25°C, JEDEC 51-3 test board | 3 | ||
| Thermal Resistance Junction-to-Case | θJC | 8 | °C/W | 3 | |||
| Supply Input Voltage | 2.5 | 15 | V | 3 | |||
| Junction Temperature Range | -40 | 125 | °C | 3 | |||
| Ambient Temperature Range | -40 | 85 | °C | 3 | |||
| Input Voltage Range | VIN | 2.5 | 30 | V | 3 | ||
| Input UVLO Threshold | VUVLO | 2.2 | 2.4 | V | VCP=LOW | 3 | |
| Input UVLO Threshold | VUVLO | 3.4 | 3.8 | V | VCP=HIGH | 3 | |
| Input UVLO Threshold | VUVLO | 8.1 | 9 | V | VCP=OPEN | 3 | |
| UVLO hysteresis | VHYS | 0.05 | 0.085 | 0.13 | V | VCP=LOW | 3 |
| UVLO hysteresis | VHYS | 0.06 | 0.095 | 0.15 | V | VCP=HIGH | 3 |
| UVLO hysteresis | VHYS | 0.1 | 0.19 | 0.29 | V | VCP=OPEN | 3 |
| Bias Current | IBIAS | 200 | µA | 3 | |||
| Shutdown Current | ISHDN | 10 | µA | EN=0 | 3 | ||
| Protection FET RON | RDS(ON) | 50 | 80 | mΩ | 3 | ||
| Current Limit Accuracy | -30 | 30 | % | Of ILIM | 3 | ||
| Current Limit Program Range | ILIM | 1 | 4 | A | 3 | ||
| Clamping Output Voltage | VCLP | 3.6 | 3.8 | 4 | V | VCP=LOW | 3 |
| Clamping Output Voltage | VCLP | 5.4 | 5.7 | 6 | V | VCP=HIGH | 3 |
| Clamping Output Voltage | VCLP | 12.6 | 13.3 | 14 | V | VCP=OPEN | 3 |
| Soft-start Time | TSST | 29.4 | ms | CSST=105nF | 3 | ||
| Soft-start Time Accuracy | -30 | 30 | % | Of TSST | 3 | ||
| EN Turn-on Threshold | VEN_ON | 2 | V | 3 | |||
| EN Turn-off Threshold | VEN_OFF | 0.4 | V | 3 | |||
| Thermal Shutdown Temperature | TSD | 140 | °C | 3 | |||
| Thermal Shutdown Hysteresis | THYS | 20 | °C | 3 |
CAD (KiCad official)
- Symbol:
SY6874DBC - Footprint:
Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm - 3D model: DFN-10-EP(3x3) (KiCad packages3D, STEP)
- 3D model files:
sy6874dbc-etched.step/sy6874dbc-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sy6874dbc.step/sy6874dbc.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Silergy Corp datasheet (9 pp, sha256
2905ad4b5488934b, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).