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SX3B13.824F0810F30

Shenzhen SCTF Elec · Crystals · SMD3225-4P

SX3B13.824F0810F30 from Shenzhen SCTF Elec, in a SMD3225-4P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 XTAL1 passive Crystal terminal of the 13.824 MHz fundamental-mode resonator (CL 08 pF, ESR 80 Ω max, drive level 100 µW max).
2 GND power_in Connected to the metal cover; datasheet says to connect to GND or leave floating.
3 XTAL2 passive Second crystal terminal of the 13.824 MHz fundamental-mode resonator (CL 08 pF, ESR 80 Ω max, drive level 100 µW max).
4 GND power_in Connected to the metal cover; datasheet says to connect to GND or leave floating, and the pad may be missing on this pin.

Key specifications

Parameter Value
Manufacturer Shenzhen SCTF Elec
Package SMD3225-4P
Category Crystal Oscillator/Oscillator/Resonator
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Frequency Tolerance Δf/f -10 10 ppm at 25℃±2℃ 3
Temperature Drift f_tem -30 30 ppm Over Operating Temp. Range (Reference 25℃) 3
1st Year Aging f_age -3 3 ppm 1st Year 3
Shunt Capacitance C0 3 pF 3
Effective Resistance RR 80 Ω 3
Drive Level Dependency DLD2 20 Ω Sweep from 100nW to 100uW in 20 steps 3
Spurious response SPDB -3 dB Start -1000ppm stop 5000ppm 30 steps, power applied: 10dBm 3
Insulation Resistance IR 500 MΩ at DC 100V 3
Drive Level DL 10 100 μW 10 μW typical, 100μW max. 3
Operating Temperature Range T_use -40 85 ℃ 3
Storage Temperature Range T_sta -55 125 ℃ 3
Negative Resistance -R 400 Ω See the 2.3 3
Nominal Frequency f 13.824 MHz Fundamental 3
Load Capacitance CL 8 pF 3

CAD (KiCad official)

  • Symbol: SX3B13.824F0810F30
  • Footprint: Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mm
  • 3D model: SMD3225-4P (KiCad packages3D, STEP)
  • 3D model files: sx3b13-824f0810f30-etched.step / sx3b13-824f0810f30-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sx3b13-824f0810f30.step / sx3b13-824f0810f30.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen SCTF Elec datasheet (8 pp, sha256 cc2c7beea9329280, retrieved 2026-10-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF