# SWP046R08E9T

**Samwin** · MOSFETs · TO-220

SWP046R08E9T from Samwin, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate control terminal with a maximum gate-to-source voltage of ±20 V and a threshold voltage of 2 V min to 4 V max at VDS=VGS, ID=250uA. |
| 2 | Drain | passive | Drain terminal rated for 80 V drain-to-source voltage and 160 A continuous drain current at TC=25°C (640 A pulsed). |
| 3 | Source | passive | Source terminal carrying up to 160 A continuous body-diode source current (640 A pulsed), with typical RDS(ON) of 4.5 mΩ at VGS=10V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Samwin |
| Package | TO-220 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain to source breakdown voltage | BVDSS | 80 |  |  | V | VGS=0V, ID=250uA | 2 |
| Drain to source leakage current | IDSS |  |  | 1 | uA | VDS=80V, VGS=0V | 2 |
| Drain to source leakage current | IDSS |  |  | 50 | uA | VDS=64V, TJ=125oC | 2 |
| Gate to source leakage current, forward | IGSS |  |  | 100 | nA | VGS=20V, VDS=0V | 2 |
| Gate to source leakage current, reverse | IGSS | -100 |  |  | nA | VGS=-20V, VDS=0V | 2 |
| Gate threshold voltage | VGS(TH) | 2 |  | 4 | V | VDS=VGS, ID=250uA | 2 |
| Drain to source on state resistance | RDS(ON) |  | 4.5 | 5.9 | mΩ | VGS=10V, ID=30A, TJ=25oC | 2 |
| Drain to source on state resistance | RDS(ON) |  | 7.8 |  | mΩ | VGS=10V, ID=30A, TJ=125oC | 2 |
| Diode forward voltage drop | VSD |  |  | 1.4 | V | IS=30A, VGS=0V | 2 |
| Continuous source current | IS |  |  | 160 | A | Integral reverse p-n junction diode in the MOSFET | 2 |
| Pulsed source current | ISM |  |  | 640 | A |  | 2 |
| Drain to source voltage | VDSS |  |  | 80 | V |  | 1 |
| Continuous drain current | ID |  |  | 160 | A | @TC=25oC, limited by junction temperature | 1 |
| Continuous drain current | ID |  |  | 106 | A | @TC=100oC, limited by junction temperature | 1 |
| Drain current pulsed | IDM |  |  | 640 | A | note 1 | 1 |
| Gate to source voltage | VGS | -20 |  | 20 | V |  | 1 |
| Single pulsed avalanche energy | EAS |  |  | 361 | mJ | note 2 | 1 |
| Repetitive avalanche energy | EAR |  |  | 30 | mJ | note 1 | 1 |
| Peak diode recovery dv/dt | dv/dt |  |  | 5 | V/ns | note 3 | 1 |
| Total power dissipation | PD |  |  | 245 | W | @TC=25oC | 1 |
| Operating junction and storage temperature | TSTG, TJ | -55 |  | 150 | °C |  | 1 |
| Maximum lead temperature for soldering | TL |  |  | 300 | °C | 1/8 from case for 5 seconds | 1 |
| Thermal resistance, junction to case | Rthjc |  |  | 0.51 | °C/W |  | 1 |
| Thermal resistance, junction to ambient | Rthja |  |  | 47.6 | °C/W |  | 1 |
| Breakdown voltage temperature coefficient | ΔBVDSS/ΔTJ |  | 0.08 |  | V/oC | ID=250uA, referenced to 25oC | 2 |
| Forward transconductance | Gfs |  | 68 |  | S | VDS=5V, ID=30A | 2 |
| Input capacitance | Ciss |  | 8570 |  | pF | VGS=0V, VDS=40V, f=1MHz | 2 |
| Output capacitance | Coss |  | 625 |  | pF | VGS=0V, VDS=40V, f=1MHz | 2 |
| Reverse transfer capacitance | Crss |  | 400 |  | pF | VGS=0V, VDS=40V, f=1MHz | 2 |
| Turn on delay time | td(on) |  | 35 |  | ns | VDS=40V, ID=30A, RG=4.7Ω, VGS=10V | 2 |
| Rising time | tr |  | 75 |  | ns | VDS=40V, ID=30A, RG=4.7Ω, VGS=10V | 2 |
| Turn off delay time | td(off) |  | 171 |  | ns | VDS=40V, ID=30A, RG=4.7Ω, VGS=10V | 2 |
| Fall time | tf |  | 68 |  | ns | VDS=40V, ID=30A, RG=4.7Ω, VGS=10V | 2 |
| Total gate charge | Qg |  | 182 |  | nC | VDS=64V, VGS=10V, ID=30A, IG=5mA | 2 |
| Gate-source charge | Qgs |  | 39 |  | nC | VDS=64V, VGS=10V, ID=30A, IG=5mA | 2 |
| Gate-drain charge | Qgd |  | 63 |  | nC | VDS=64V, VGS=10V, ID=30A, IG=5mA | 2 |
| Gate resistance | Rg |  | 3.4 |  | Ω | VDS=0V, Scan F mode | 2 |
| Reverse recovery time | trr |  | 49 |  | ns | IS=30A, VGS=0V, dIF/dt=100A/us | 2 |
| Reverse recovery charge | Qrr |  | 90 |  | nC | IS=30A, VGS=0V, dIF/dt=100A/us | 2 |

## CAD (KiCad official)

- Symbol: `SWP046R08E9T`
- Footprint: `Package_TO_SOT_THT:TO-220-3_Vertical`
- 3D model: TO-220 (KiCad packages3D, STEP)
- 3D model files: `swp046r08e9t-etched.step` / `swp046r08e9t-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `swp046r08e9t.step` / `swp046r08e9t.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Samwin datasheet](docs/swp046r08e9t-datasheet.pdf) (6 pp, sha256 `788033d75f638af1`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/swp046r08e9t-datasheet.pdf)