component
SWI7N65D
Public Made by Adomby adom
Samwin MOSFETs, TO-251. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SWI7N65D
Samwin · MOSFETs · TO-251
SWI7N65D from Samwin, in a TO-251. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal of the N-channel MOSFET; the gate-to-source voltage is rated ±30 V (VGS). |
| 2 | Drain | passive | Drain terminal; the drain-to-source voltage is rated 650 V (VDSS) and continuous drain current is 7 A at TC=25 °C, limited by junction temperature. |
| 3 | Source | passive | Source terminal; the integral reverse p-n junction body diode has a continuous source current rating of 7 A and pulsed source current of 28 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Samwin |
| Package | TO-251 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain to source voltage | VDSS | 650 | V | 1 | |||
| Continuous drain current | ID | 7 | A | @TC=25oC | 1 | ||
| Continuous drain current | ID | 4.4 | A | @TC=100oC | 1 | ||
| Drain current pulsed | IDM | 28 | A | note 1 | 1 | ||
| Gate to source voltage | VGS | -30 | 30 | V | 1 | ||
| Single pulsed avalanche energy | EAS | 430 | mJ | note 2 | 1 | ||
| Repetitive avalanche energy | EAR | 40 | mJ | note 1 | 1 | ||
| Peak diode recovery dv/dt | dv/dt | 5 | V/ns | note 3 | 1 | ||
| Total power dissipation | PD | 173.6 | W | @TC=25oC, TO-251 column | 1 | ||
| Derating factor above 25oC | 1.39 | W/oC | TO-251 column | 1 | |||
| Operating junction temperature and storage temperature | TSTG, TJ | -55 | 150 | oC | 1 | ||
| Maximum lead temperature for soldering purpose | TL | 300 | oC | 1/8 from case for 5 seconds | 1 | ||
| Drain to source breakdown voltage | BVDSS | 650 | V | VGS=0V, ID=250uA | 2 | ||
| Drain to source leakage current | IDSS | 1 | uA | VDS=650V, VGS=0V | 2 | ||
| Drain to source leakage current | IDSS | 50 | uA | VDS=520V, TJ=125oC | 2 | ||
| Gate to source leakage current, forward | IGSS | 100 | nA | VGS=30V, VDS=0V | 2 | ||
| Gate to source leakage current, reverse | IGSS | -100 | nA | VGS=-30V, VDS=0V | 2 | ||
| Gate threshold voltage | VGS(TH) | 2.5 | 4.5 | V | VDS=VGS, ID=250uA | 2 | |
| Drain to source on state resistance | RDS(ON) | 1.1 | 1.4 | Ω | VGS=10V, ID = 3.5A, TJ=25oC | 2 | |
| Drain to source on state resistance | RDS(ON) | 2.4 | Ω | VGS=10V, ID = 3.5A, TJ=125oC | 2 | ||
| Continuous source current | IS | 7 | A | Integral reverse p-n junction diode in the MOSFET | 2 | ||
| Pulsed source current | ISM | 28 | A | 2 | |||
| Diode forward voltage drop | VSD | 1.4 | V | IS=7A, VGS=0V | 2 | ||
| Thermal resistance, Junction to case | Rthjc | 0.72 | oC/W | TO-251 column | 2 | ||
| Thermal resistance, Junction to ambient | Rthja | 82 | oC/W | TO-251 column | 2 |
CAD (KiCad official)
- Symbol:
SWI7N65D - Footprint:
Package_TO_SOT_THT:TO-251-3_Vertical - 3D model: TO-251 (KiCad packages3D, STEP)
- 3D model files:
swi7n65d-etched.step/swi7n65d-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);swi7n65d.step/swi7n65d.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Samwin datasheet (8 pp, sha256
896ad7fd66d17340, retrieved 2026-11-07, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SWI7N65D
**Samwin** · MOSFETs · TO-251
SWI7N65D from Samwin, in a TO-251. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal of the N-channel MOSFET; the gate-to-source voltage is rated ±30 V (VGS). |
| 2 | Drain | passive | Drain terminal; the drain-to-source voltage is rated 650 V (VDSS) and continuous drain current is 7 A at TC=25 °C, limited by junction temperature. |
| 3 | Source | passive | Source terminal; the integral reverse p-n junction body diode has a continuous source current rating of 7 A and pulsed source current of 28 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Samwin |
| Package | TO-251 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain to source voltage | VDSS | | | 650 | V | | 1 |
| Continuous drain current | ID | | | 7 | A | @TC=25oC | 1 |
| Continuous drain current | ID | | | 4.4 | A | @TC=100oC | 1 |
| Drain current pulsed | IDM | | | 28 | A | note 1 | 1 |
| Gate to source voltage | VGS | -30 | | 30 | V | | 1 |
| Single pulsed avalanche energy | EAS | | | 430 | mJ | note 2 | 1 |
| Repetitive avalanche energy | EAR | | | 40 | mJ | note 1 | 1 |
| Peak diode recovery dv/dt | dv/dt | | | 5 | V/ns | note 3 | 1 |
| Total power dissipation | PD | | | 173.6 | W | @TC=25oC, TO-251 column | 1 |
| Derating factor above 25oC | | | 1.39 | | W/oC | TO-251 column | 1 |
| Operating junction temperature and storage temperature | TSTG, TJ | -55 | | 150 | oC | | 1 |
| Maximum lead temperature for soldering purpose | TL | | | 300 | oC | 1/8 from case for 5 seconds | 1 |
| Drain to source breakdown voltage | BVDSS | 650 | | | V | VGS=0V, ID=250uA | 2 |
| Drain to source leakage current | IDSS | | | 1 | uA | VDS=650V, VGS=0V | 2 |
| Drain to source leakage current | IDSS | | | 50 | uA | VDS=520V, TJ=125oC | 2 |
| Gate to source leakage current, forward | IGSS | | | 100 | nA | VGS=30V, VDS=0V | 2 |
| Gate to source leakage current, reverse | IGSS | -100 | | | nA | VGS=-30V, VDS=0V | 2 |
| Gate threshold voltage | VGS(TH) | 2.5 | | 4.5 | V | VDS=VGS, ID=250uA | 2 |
| Drain to source on state resistance | RDS(ON) | | 1.1 | 1.4 | Ω | VGS=10V, ID = 3.5A, TJ=25oC | 2 |
| Drain to source on state resistance | RDS(ON) | | | 2.4 | Ω | VGS=10V, ID = 3.5A, TJ=125oC | 2 |
| Continuous source current | IS | | | 7 | A | Integral reverse p-n junction diode in the MOSFET | 2 |
| Pulsed source current | ISM | | | 28 | A | | 2 |
| Diode forward voltage drop | VSD | | | 1.4 | V | IS=7A, VGS=0V | 2 |
| Thermal resistance, Junction to case | Rthjc | | 0.72 | | oC/W | TO-251 column | 2 |
| Thermal resistance, Junction to ambient | Rthja | | 82 | | oC/W | TO-251 column | 2 |
## CAD (KiCad official)
- Symbol: `SWI7N65D`
- Footprint: `Package_TO_SOT_THT:TO-251-3_Vertical`
- 3D model: TO-251 (KiCad packages3D, STEP)
- 3D model files: `swi7n65d-etched.step` / `swi7n65d-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `swi7n65d.step` / `swi7n65d.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Samwin datasheet](docs/swi7n65d-datasheet.pdf) (8 pp, sha256 `896ad7fd66d17340`, retrieved 2026-11-07, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/swi7n65d-datasheet.pdf)