component
SWD4N60D
Public Made by Adomby adom
Samwin MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 8d ago |
| viewers | 8d ago |
| package.json | 8d ago |
| page.json | 8d ago |
| README.md | 8d ago |
| swd4n60d-etched.glb | 8d ago |
| swd4n60d-etched.step | 8d ago |
| swd4n60d-hero.glb | 8d ago |
| swd4n60d-hero.overlay.json | 8d ago |
| swd4n60d.glb | 8d ago |
| swd4n60d.kicad_mod | 8d ago |
| swd4n60d.kicad_sym | 8d ago |
| swd4n60d.lbr | 8d ago |
| swd4n60d.step | 8d ago |
SWD4N60D
Samwin · MOSFETs · TO-252
SWD4N60D from Samwin, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal; gate-to-source voltage is limited to ±30 V, with a typical threshold of 2.5 to 4.5 V at ID=250uA and RDS(ON) specified at VGS=10V. |
| 2 | Drain | passive | Drain terminal; drain-to-source voltage rating is 600 V with continuous drain current of 4 A and pulsed drain current of 16 A. |
| 3 | Source | passive | Source terminal; connects to the integral body diode with continuous source current of 4 A and pulsed source current of 16 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Samwin |
| Package | TO-252 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain to Source Breakdown Voltage | BVDSS | 600 | V | VGS=0V, ID=250uA | 2 | ||
| Drain to source leakage current | IDSS | 1 | uA | VDS=600V, VGS=0V | 2 | ||
| Drain to source leakage current | IDSS | 50 | uA | VDS=480V, TC=125oC | 2 | ||
| Gate to source leakage current, forward | IGSS | 100 | nA | VGS=30V, VDS=0V | 2 | ||
| Gate to source leakage current, reverse | IGSS | -100 | nA | VGS=-30V, VDS=0V | 2 | ||
| Gate threshold voltage | VGS(TH) | 2.5 | 4.5 | V | VDS=VGS, ID=250uA | 2 | |
| Drain to source on state resistance | RDS(ON) | 1.9 | 2.2 | Ω | VGS=10V, ID=2A | 2 | |
| Continuous source current | IS | 4 | A | Integral reverse p-n Junction diode in the MOSFET | 2 | ||
| Pulsed source current | ISM | 16 | A | Integral reverse p-n Junction diode in the MOSFET | 2 | ||
| Diode forward voltage drop | VSD | 1.4 | V | IS=4A, VGS=0V | 2 | ||
| Drain to Source Voltage | VDSS | 600 | V | 1 | |||
| Continuous Drain Current | ID | 4 | A | TC=25oC | 1 | ||
| Continuous Drain Current | ID | 2.5 | A | TC=100oC | 1 | ||
| Drain current pulsed | IDM | 16 | A | note 1 | 1 | ||
| Gate to Source Voltage | VGS | -30 | 30 | V | 1 | ||
| Single pulsed Avalanche Energy | EAS | 184 | mJ | note 2 | 1 | ||
| Repetitive Avalanche Energy | EAR | 55 | mJ | note 1 | 1 | ||
| Peak diode Recovery dv/dt | dv/dt | 5 | V/ns | note 3 | 1 | ||
| Total power dissipation | PD | 141 | W | TC=25oC, TO-252 | 1 | ||
| Derating Factor above 25oC | 1.13 | W/oC | TO-252 | 1 | |||
| Operating Junction Temperature & Storage Temperature | TSTG, TJ | -55 | 150 | oC | 1 | ||
| Maximum Lead Temperature for soldering | TL | 300 | oC | 1/8 from Case for 5 seconds | 1 | ||
| Thermal resistance, Junction to case | Rthjc | 0.89 | oC/W | TO-252 | 1 | ||
| Thermal resistance, Junction to ambient | Rthja | 79 | oC/W | TO-252 | 1 | ||
| Breakdown voltage temperature coefficient | ΔBVDSS/ΔTJ | 0.47 | V/oC | ID=250uA, referenced to 25oC | 2 | ||
| Forward Transconductance | Gfs | 3.5 | S | VDS=30 V,ID =2A | 2 | ||
| Input capacitance | Ciss | 651 | pF | VGS=0V, VDS=25V, f=1MHz | 2 | ||
| Output capacitance | Coss | 70 | pF | VGS=0V, VDS=25V, f=1MHz | 2 | ||
| Reverse transfer capacitance | Crss | 8.4 | pF | VGS=0V, VDS=25V, f=1MHz | 2 | ||
| Total gate charge | Qg | 18 | nC | VDS=480V, VGS=10V, ID=4A | 2 | ||
| Gate resistance | Rg | 3.1 | Ω | VDS=0V, Scan F mode | 2 |
CAD (KiCad official)
- Symbol:
SWD4N60D - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
swd4n60d-etched.step/swd4n60d-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);swd4n60d.step/swd4n60d.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Samwin datasheet (7 pp, sha256
c83fd8d7d2375ded, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).