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SVF2N60RDTR

Hangzhou Silan Microelectronics · MOSFETs · TO-252-2

SVF2N60RDTR from Hangzhou Silan Microelectronics, in a TO-252-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate of the N-channel enhancement MOSFET; the datasheet gives a gate-source voltage rating of ±30 V.
2 D passive Drain of the MOSFET; the datasheet rates drain-source voltage at 600 V and continuous drain current at 2.0 A (TC=25°C).
3 S passive Source of the MOSFET; the datasheet rates source current at 2.0 A and pulsed source current at 8.0 A.

Key specifications

Parameter Value
Manufacturer Hangzhou Silan Microelectronics
Package TO-252-2
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
漏源电压 (Drain-source voltage) VDS 600 V 2
栅源电压 (Gate-source voltage) VGS -30 30 V 2
漏极电流 (Drain current) ID 2 A TC=25C 2
漏极电流 (Drain current) ID 1.3 A TC=100C 2
漏极脉冲电流 (Drain pulsed current) IDM 8 A 2
耗散功率 (Power dissipation) PD 34 W TC=25C 2
耗散功率降额 (Derating above 25C) PD 0.27 W/C Above 25C, reduce per degree C 2
单脉冲雪崩能量 (Single pulse avalanche energy) EAS 115 mJ 2
体二极管dv/dt (Body diode dv/dt) dv/dt 4.5 V/ns 2
MOS管dv/dt耐用性 (MOSFET dv/dt ruggedness) dv/dt 50 V/ns 2
工作结温范围 (Operating junction temperature range) TJ -55 150 C 2
贮存温度范围 (Storage temperature range) Tstg -55 150 C 2
芯片对管壳热阻 (Junction-to-case thermal resistance) RθJC 3.7 C/W 2
芯片对环境热阻 (Junction-to-ambient thermal resistance) RθJA 62 C/W 2
漏源击穿电压 (Drain-source breakdown voltage) BVDSS 600 V VGS=0V,ID=250µA 2
漏源漏电流 (Zero gate voltage drain current) IDSS 1 µA VDS=600V,VGS=0V 2
栅源漏电流 (Gate-body leakage current) IGSS -100 100 nA VGS=±30V,VDS=0V 2
栅极开启电压 (Gate threshold voltage) VGS(th) 2 4 V VGS= VDS,ID=250µA 2
导通电阻 (Static drain-source on-resistance) RDS(on) 3.7 4.2 Ω VGS=10V,ID=1.0A 2
源极电流 (Continuous source current) IS 2 A 3
源极脉冲电流 (Pulsed source current) ISM 8 A 3
源-漏二极管压降 (Diode forward voltage) VSD 1.4 V IS=2.0A,VGS=0V 3

CAD (KiCad official)

  • Symbol: SVF2N60RDTR
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2 (KiCad packages3D, STEP)
  • 3D model files: svf2n60rdtr-etched.step / svf2n60rdtr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); svf2n60rdtr.step / svf2n60rdtr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Hangzhou Silan Microelectronics datasheet (8 pp, sha256 0de0c9620c9f5e6e, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF