# SV560L_R1_00001

**PANJIT International** · Schottky Diodes · TO-277

SV560L_R1_00001 from PANJIT International, in a TO-277. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, one of the two small leads on the same side of the package, internally joined to the other lead, per the TO-277 symbol; 60 V maximum DC blocking voltage, 5 A average rectified current for the device. |
| 2 | K | passive | Cathode, the second small lead tied to the same die connection as the other lead, per the TO-277 symbol; 60 V maximum DC blocking voltage, 5 A average rectified current for the device. |
| 3 | A | passive | Anode, the large exposed pad (shown as 5.10 x 3.60 mm in the mounting pad layout) at the opposite end from the two small leads, per the TO-277 symbol. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | PANJIT International |
| Package | TO-277 |
| Category | Diodes |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage | VBR | 60 |  |  | V | IR=0.5mA TA=25°C | 2 |
| Instantaneous forward voltage | VF |  |  | 0.67 | V | IF=5A TA=25°C | 2 |
| Operating Junction Temperature and Storage Temperature range | TJ,TSTG | -55 |  | 150 | °C |  | 1 |
| Maximum Recurrent Peak Reverse Voltage | VRRM |  |  | 60 | V |  | 1 |
| Maximum RMS Voltage | VRMS |  |  | 42 | V |  | 1 |
| Maximum DC Blocking Voltage | VR |  |  | 60 | V |  | 1 |
| Average Rectified Output Current | IF(AV) |  |  | 5 | A |  | 1 |
| Peak Forward Surge Current | IFSM |  |  | 120 | A | 8.3ms single half sine-wave superimposed on rated load | 1 |
| Typical Thermal Resistance, Junction to Ambient | RθJA |  |  | 60 | °C/W |  | 1 |
| Typical Thermal Resistance, Junction to Lead | RθJL |  |  | 10 | °C/W |  | 1 |

## CAD (KiCad official)

- Symbol: `SV560L_R1_00001`
- Footprint: `Package_TO_SOT_SMD:TO-277A`
- 3D model: TO-277 (KiCad packages3D, STEP)
- 3D model files: `sv560l-r1-00001-etched.step` / `sv560l-r1-00001-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sv560l-r1-00001.step` / `sv560l-r1-00001.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [PANJIT International datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590931160828755969) (6 pp, sha256 `56e32455b009072c`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sv560l-r1-00001-datasheet.pdf)