Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

SUD50P08-25L-E3

Vishay Intertech · MOSFETs · TO-252

SUD50P08-25L-E3 from Vishay Intertech, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the P-channel MOSFET; gate-source voltage is rated at ±20 V.
2 D passive Drain terminal, which is also connected to the TO-252 tab; drain-source voltage is rated at -80 V.
3 S passive Source terminal of the P-channel MOSFET; continuous source-drain diode current is rated at -50 A at TC = 25 °C.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package TO-252
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -80 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID -50 A TJ = 175 °C, TC = 25 °C 1
Continuous Drain Current ID -42.5 A TJ = 175 °C, TC = 70 °C 1
Continuous Drain Current ID -12.5 A TA = 25 °C (notes b, c) 1
Continuous Drain Current ID -10.5 A TA = 70 °C (notes b, c) 1
Pulsed Drain Current IDM -40 A 1
Continuous Source-Drain Diode Current IS -50 A TC = 25 °C 1
Continuous Source-Drain Diode Current IS -6.9 A TA = 25 °C (notes b, c) 1
Avalanche Current IAS -45 A L = 0.1 mH 1
Single-Pulse Avalanche Energy EAS 101 mJ 1
Maximum Power Dissipation PD 136 W TC = 25 °C 1
Maximum Power Dissipation PD 95 W TC = 70 °C 1
Maximum Power Dissipation PD 8.3 W TA = 25 °C (notes b, c) 1
Maximum Power Dissipation PD 5.8 W TA = 70 °C (notes b, c) 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 175 °C 1
Maximum Junction-to-Ambient RthJA 15 18 °C/W t ≤ 10 sec 1
Maximum Junction-to-Ambient (steady state, note d) RthJA 40 °C/W Steady state (printed in note d) 1
Maximum Junction-to-Case (Drain) Steady State RthJC 0.85 1.1 °C/W Steady state, drain 1
Drain-Source Breakdown Voltage VDS -80 V VGS = 0 V, ID = -250 µA 2
Gate-Source Threshold Voltage VGS(th) -1 -3 V VDS = VGS, ID = -250 µA 2
Gate-Source Leakage IGSS -100 100 nA VDS = 0 V, VGS = ±20 V 2
Zero Gate Voltage Drain Current IDSS -1 µA VDS = -80 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS -10 µA VDS = -80 V, VGS = 0 V, TJ = 55 °C 2
Drain-Source On-State Resistance rDS(on) 0.021 0.0252 Ω VGS = -10 V, ID = -12.5 A 2
Drain-Source On-State Resistance rDS(on) 0.024 0.029 Ω VGS = -4.5 V, ID = -10.5 A 2
Total Gate Charge Qg 105 160 nC VDS = -40 V, VGS = -10 V, ID = -12.5 A 2
Total Gate Charge Qg 55 85 nC VDS = -40 V, VGS = -4.5 V, ID = -12.5 A 2
Turn-On Delay Time td(on) 45 70 ns VDD = -40 V, RL = 3.8 Ω, ID ≅ -10.5 A, VGEN = -10 V, Rg = 1 Ω 2
Rise Time tr 220 330 ns VDD = -40 V, RL = 3.8 Ω, ID ≅ -10.5 A, VGEN = -10 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 95 145 ns VDD = -40 V, RL = 3.8 Ω, ID ≅ -10.5 A, VGEN = -10 V, Rg = 1 Ω 2
Fall Time tf 110 165 ns VDD = -40 V, RL = 3.8 Ω, ID ≅ -10.5 A, VGEN = -10 V, Rg = 1 Ω 2
Turn-On Delay Time td(on) 15 25 ns VDD = -40 V, RL = 3.8 Ω, ID ≅ -10.5 A, VGEN = -4.5 V, Rg = 1 Ω 2
Rise Time tr 25 40 ns VDD = -40 V, RL = 3.8 Ω, ID ≅ -10.5 A, VGEN = -4.5 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 105 160 ns VDD = -40 V, RL = 3.8 Ω, ID ≅ -10.5 A, VGEN = -4.5 V, Rg = 1 Ω 2
Fall Time tf 100 150 ns VDD = -40 V, RL = 3.8 Ω, ID ≅ -10.5 A, VGEN = -4.5 V, Rg = 1 Ω 2
Continuous Source-Drain Diode Current IS -50 A TC = 25 °C 2
Pulse Diode Forward Current ISM -40 A 2
Body Diode Voltage VSD -0.8 -1.2 V IS = -10.5 A 2
Body Diode Reverse Recovery Time trr 55 85 ns IF = -10.5 A, di/dt = 100 A/µs, TJ = 25 °C 2
Body Diode Reverse Recovery Charge Qrr 110 165 nC IF = -10.5 A, di/dt = 100 A/µs, TJ = 25 °C 2
VDS Temperature Coefficient ΔVDS/TJ -73 mV/°C ID = -250 µA 2
VGS(th) Temperature Coefficient ΔVGS(th)/TJ -5.5 mV/°C 2
Forward Transconductance gfs 52 S VDS = -15 V, ID = -12.5 A 2
Input Capacitance Ciss 4700 pF VDS = -40 V, VGS = 0 V, f = 1 MHz 2
Output Capacitance Coss 320 pF VDS = -40 V, VGS = 0 V, f = 1 MHz 2
Reverse Transfer Capacitance Crss 235 pF VDS = -40 V, VGS = 0 V, f = 1 MHz 2
Gate-Source Charge Qgs 16 nC 2
Gate-Drain Charge Qgd 26 nC 2
Gate Resistance Rg 4 Ω f = 1 MHz 2
Reverse Recovery Fall Time ta 37 ns 2
Reverse Recovery Rise Time tb 18 ns 2

CAD (KiCad official)

  • Symbol: SUD50P08-25L-E3
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: sud50p08-25l-e3-etched.step / sud50p08-25l-e3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sud50p08-25l-e3.step / sud50p08-25l-e3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (7 pp, sha256 860cadfd3fd4075e, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF