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Contents

README

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SUD23N06-31

UMW · MOSFETs · TO-252

SUD23N06-31 from UMW, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input GATE terminal of the 60 V N-channel MOSFET; the absolute maximum gate-source voltage is VGS = ±20 V.
2 D passive DRAIN terminal of the 60 V N-channel MOSFET, rated VDS = 60 V and ID = 35 A per the features list.
3 S passive SOURCE terminal of the MOSFET; the continuous source (diode) current IS is listed in the absolute maximum ratings, and the source-drain diode ratings are given on page 4.

Key specifications

Parameter Value
Manufacturer UMW
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID 35 A TC=25°C 1
Continuous Drain Current ID 28 A TC=125°C 1
Pulsed Drain Current IDM 100 A 1
Continuous Source Current (Diode Conduction) IS 23 A 1
Avalanche Current IAS 20 A 1
Single Avalanche Energy EAS 20 mJ Duty cycle ≤ 1 %, L=0.1mH 1
Maximum Power Dissipation PD 100 W TC=25°C 1
Maximum Power Dissipation PD 3 W TA=25°C 1
Junction and Storage Temperature Range TJ,TSTG -55 150 °C 1
Maximum Junction-to-Ambient (t ≤10s) RthJA 18 22 °C/W t ≤10s, surface mounted on 1" x 1" FR4 board 2
Maximum Junction-to-Ambient (steady state) RthJA 40 50 °C/W Steady state, surface mounted on 1" x 1" FR4 board 2
Maximum Junction-to-Case RthJC 3.2 4 °C/W 2
Drain-Source Breakdown Voltage V(BR)DSS 60 V VGS=0V, ID=250µA 3
Gate-Body Leakage IGSS -100 100 nA VGS=±20V, VDS=0V 3
Zero gate voltage drain current IDSS 1 µA VDS=60V, VGS=0V 3
Zero gate voltage drain current IDSS 50 µA VDS=60V, VGS=0V, TJ=125°C 3

CAD (KiCad official)

  • Symbol: SUD23N06-31
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: sud23n06-31-etched.step / sud23n06-31-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sud23n06-31.step / sud23n06-31.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UMW datasheet (9 pp, sha256 c81cdba9941f2d54, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF