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STTH2R02UY

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by adom

STMicroelectronics Fast Recovery / High Efficiency Diodes, DO-214AA. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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STTH2R02UY

STMicroelectronics · Fast Recovery / High Efficiency Diodes · DO-214AA

STTH2R02UY from STMicroelectronics, in a DO-214AA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package DO-214AA
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 200 V Tj = -40 °C to +175 °C 2
Repetitive peak forward current IFRM 60 A tp = 5 µs, f = 5 kHz 2
Forward rms current IF(RMS) 60 A 2
Average forward current IF(AV) 2 A δ = 0.5, square wave, TL = 90 °C 2
Surge non repetitive forward current IFSM 75 A tp = 10 ms sinusoidal 2
Storage temperature range Tstg -65 175 °C 2
Operating junction temperature range Tj -40 175 °C See note 1: (dPtot/dTj) < (1/Rth(j-a)) to avoid thermal runaway for a diode on its own heatsink 2
Junction to lead thermal resistance Rth(j-l) 30 °C/W 2
Reverse leakage current IR 3 µA Tj = 25 °C, VR = VRRM, pulse test tp = 5 ms, δ < 2% 2
Reverse leakage current IR 2 20 µA Tj = 125 °C, VR = VRRM, pulse test tp = 5 ms, δ < 2% 2
Forward voltage drop VF 1.2 V Tj = 25 °C, IF = 6 A, pulse test tp = 380 µs, δ < 2% 2
Forward voltage drop VF 0.89 1 V Tj = 25 °C, IF = 2 A, pulse test tp = 380 µs, δ < 2% 2
Forward voltage drop VF 0.76 0.85 V Tj = 100 °C, IF = 2 A, pulse test tp = 380 µs, δ < 2% 2
Forward voltage drop VF 0.7 0.8 V Tj = 150 °C, IF = 2 A, pulse test tp = 380 µs, δ < 2% 2
Reverse recovery time trr 23 30 ns Tj = 25 °C, IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V 3
Reverse recovery time trr 15 20 ns Tj = 25 °C, IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V 3
Reverse recovery current IRM 3 4 A IF = 2 A, dIF/dt = -200 A/µs, VR = 160 V, Tj = 125 °C 3
Forward recovery time tfr 40 ns IF = 2 A, dIF/dt = 100 A/µs, VFR = 1.1 VF(max.) 3
Forward recovery voltage VFP 2 V IF = 2 A, dIF/dt = 100 A/µs 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (typical values) 5

CAD (KiCad official)

  • Symbol: STTH2R02UY
  • Footprint: Diode_SMD:D_SMB
  • 3D model: DO-214AA (KiCad packages3D, STEP)
  • 3D model files: stth2r02uy-etched.step / stth2r02uy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stth2r02uy.step / stth2r02uy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (10 pp, sha256 c11d46a3d37828bd, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF