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Contents

README

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STTH1R06U

STMicroelectronics · Diodes - Fast Recovery Rectifiers · SMB

STTH1R06U from STMicroelectronics, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 600 V 2
Forward rms current (SMB) IF(RMS) 7 A SMB package 2
Average forward current (SMB) IF(AV) 1 A SMB, Tc = 135 °C, δ = 0.5 2
Surge non repetitive forward current (SMB) IFSM 20 A SMB, tp = 10 ms sinusoidal 2
Storage temperature range Tstg -65 175 °C 2
Maximum operating junction temperature Tj 175 °C 2
Junction to lead thermal resistance (SMB) Rth(j-l) 25 °C/W SMB, L = 10 mm 2
Reverse leakage current IR 1 µA Tj = 25 °C, VR = VRRM 2
Reverse leakage current IR 10 75 µA Tj = 150 °C 2
Forward voltage drop VF 1.7 V Tj = 25 °C, IF = 1 A 2
Forward voltage drop VF 1 1.25 V Tj = 150 °C 2
Reverse recovery time trr 25 ns Tj = 25 °C, IF = 0.5 A, Irr = 0.25 A, IR = 1 A 3
Reverse recovery time trr 30 45 ns IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V 3
Forward recovery time tfr 100 ns Tj = 25 °C, IF = 1 A, dIF/dt = 100 A/µs, VFR = 1.1 x VFmax 3
Forward recovery voltage VFP 10 V Tj = 25 °C, IF = 1 A, dIF/dt = 100 A/µs, VFR = 1.1 x VFmax 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper under each lead Figure 15. Thermal resistance junction to ambient versus copper surface under each lead 5

CAD (KiCad official)

  • Symbol: STTH1R06U
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: stth1r06u-etched.step / stth1r06u-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stth1r06u.step / stth1r06u.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (9 pp, sha256 e2bd1620c5dbc0f7, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF