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Contents

README

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STTH1R04U

STMicroelectronics · Fast Recovery / High Efficiency Diodes · SMB

STTH1R04U from STMicroelectronics, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 400 V 2
Average forward current (SMB) IF(AV) 1 A δ = 0.5, SMB Tlead = 140 °C 2
Surge non repetitive forward current IFSM 30 A tp = 10 ms Sinusoidal 2
Storage temperature range Tstg -65 175 °C 2
Maximum operating junction temperature Tj 175 °C On infinite heatsink with 10 mm lead length (footnote 1) 2
Junction to lead thermal resistance (SMB) Rth(j-l) 25 °C/W Lead length = 10 mm on infinite heatsink 2
Reverse leakage current IR 5 µA Tj = 25 °C, VR = VRRM 2
Reverse leakage current IR 5 50 µA Tj = 125 °C 2
Forward voltage drop VF 1.5 V Tj = 25 °C, IF = 1.0 A 2
Forward voltage drop VF 1 1.25 V Tj = 100 °C 2
Forward voltage drop VF 0.9 1.15 V Tj = 150 °C 2
Reverse recovery time trr 30 ns IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25 °C 3
Reverse recovery time trr 14 20 ns IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25 °C 3
Reverse recovery current IRM 2.5 3.5 A IF = 1 A, dIF/dt = -200 A/µs, VR = 320 V, Tj = 125 °C 3
Forward recovery time tfr 50 ns IF = 1 A, dIF/dt = 100 A/µs, VFR = 1.1 x VFmax, Tj = 25 °C 3
Forward recovery voltage VFP 3.5 V IF = 1 A, dIF/dt = 100 A/µs 3

CAD (KiCad official)

  • Symbol: STTH1R04U
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: stth1r04u-etched.step / stth1r04u-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stth1r04u.step / stth1r04u.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (10 pp, sha256 f339b526c22970d4, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF