component
STSPIN32F0601TR
Public Made by Adomby adom
STMicroelectronics Microcontrollers (MCU/MPU/SOC), TQFP-64(10x10). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
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| README.md | 1d ago |
| stspin32f0601tr-etched.glb | 1d ago |
| stspin32f0601tr-etched.step | 1d ago |
| stspin32f0601tr-hero.glb | 1d ago |
| stspin32f0601tr-hero.overlay.json | 1d ago |
| stspin32f0601tr.glb | 1d ago |
| stspin32f0601tr.kicad_mod | 1d ago |
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| stspin32f0601tr.lbr | 1d ago |
| stspin32f0601tr.step | 1d ago |
STSPIN32F0601TR
STMicroelectronics · Microcontrollers (MCU/MPU/SOC) · TQFP-64(10x10)
STSPIN32F0601TR from STMicroelectronics, in a TQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PB8 | bidirectional | MCU PB8 I/O, FTf type: 5 V-tolerant and FM+ capable. |
| 2 | VSS | power_in | MCU digital ground. |
| 3 | VDD | power_in | MCU digital power supply. |
| 4 | PC13 | bidirectional | MCU PC13 I/O, TC type: standard 3.3 V I/O. |
| 5 | PC14 | bidirectional | MCU PC14 I/O, TC type: standard 3.3 V I/O. |
| 6 | PC15 | bidirectional | MCU PC15 I/O, TC type: standard 3.3 V I/O. |
| 7 | PF0 | bidirectional | MCU PF0 I/O, FT type: 5 V-tolerant I/O. |
| 8 | PF1 | bidirectional | MCU PF1 I/O, FT type: 5 V-tolerant I/O. |
| 9 | NRST | bidirectional | MCU reset pin, bidirectional with embedded weak pull-up resistor. |
| 10 | VSSA | power_in | MCU analog ground. |
| 11 | VDDA | power_in | MCU analog power supply. |
| 12 | PA0 | bidirectional | MCU PA0 I/O, TTa type: 3.3 V-tolerant and directly connected to ADC. |
| 13 | PA1 | bidirectional | MCU PA1 I/O, TTa type: 3.3 V-tolerant and directly connected to ADC. |
| 14 | PA2 | bidirectional | MCU PA2 I/O, TTa type: 3.3 V-tolerant and directly connected to ADC. |
| 15 | PA3 | bidirectional | MCU PA3 I/O, TTa type: 3.3 V-tolerant and directly connected to ADC. |
| 16 | PA4 | bidirectional | MCU PA4 I/O, TTa type: 3.3 V-tolerant and directly connected to ADC. |
| 17 | PA5 | bidirectional | MCU PA5 I/O, TTa type: 3.3 V-tolerant and directly connected to ADC. |
| 18 | PA6 | bidirectional | MCU PA6 I/O, TTa type: 3.3 V-tolerant and directly connected to ADC. |
| 19 | PA7 | bidirectional | MCU PA7 I/O, TTa type: 3.3 V-tolerant and directly connected to ADC. |
| 20 | PB0 | bidirectional | MCU PB0 I/O, TTa type: 3.3 V-tolerant and directly connected to ADC. |
| 21 | PB1 | bidirectional | MCU PB1 I/O, TTa type: 3.3 V-tolerant and directly connected to ADC. |
| 22 | VDD | power_in | MCU digital power supply. |
| 23 | VSS | power_in | MCU digital ground. |
| 24 | OD | output | Open-drain comparator output (OD pin, rated up to 21 V absolute maximum). |
| 25 | CIN | input | Comparator positive input (absolute maximum 20 V). |
| 26 | SGND | power_in | Driver signal ground; the EPAD is internally connected to this pin. |
| 27 | PGND | power_in | Driver power ground for the low-side gate drivers. |
| 28 | LVG1 | output | Phase 1 low-side driver output; less than 1 V at 10 mA sink with VCC > 3 V. |
| 29 | LVG2 | output | Phase 2 low-side driver output; less than 1 V at 10 mA sink with VCC > 3 V. |
| 30 | LVG3 | output | Phase 3 low-side driver output; less than 1 V at 10 mA sink with VCC > 3 V. |
| 31 | RES4 | unconnected | Reserved pin, must be left floating. |
| 32 | NC | unconnected | Not connected. |
| 33 | OUT1 | passive | Phase 1 high-side (floating) common voltage. |
| 34 | HVG1 | output | Phase 1 high-side driver output; less than 1 V at 10 mA sink with VCC > 3 V. |
| 35 | BOOT1 | power_in | Phase 1 bootstrap supply voltage. |
| 36 | NC | unconnected | Not connected. |
| 37 | NC | unconnected | Not connected. |
| 38 | NC | unconnected | Not connected. |
| 39 | NC | unconnected | Not connected. |
| 40 | OUT2 | passive | Phase 2 high-side (floating) common voltage. |
| 41 | HVG2 | output | Phase 2 high-side driver output; less than 1 V at 10 mA sink with VCC > 3 V. |
| 42 | BOOT2 | power_in | Phase 2 bootstrap supply voltage. |
| 43 | NC | unconnected | Not connected. |
| 44 | NC | unconnected | Not connected. |
| 45 | NC | unconnected | Not connected. |
| 46 | OUT3 | passive | Phase 3 high-side (floating) common voltage. |
| 47 | HVG3 | output | Phase 3 high-side driver output; less than 1 V at 10 mA sink with VCC > 3 V. |
| 48 | BOOT3 | power_in | Phase 3 bootstrap supply voltage. |
| 49 | NC | unconnected | Not connected. |
| 50 | RES5 | unconnected | Reserved pin, must be left floating. |
| 51 | VCC | power_in | Driver low-side and logic supply voltage (absolute maximum 21 V). |
| 52 | RES1 | unconnected | Reserved pin, must be left floating. |
| 53 | RES2 | unconnected | Reserved pin, must be left floating. |
| 54 | RES3 | unconnected | Reserved pin, must be left floating. |
| 55 | PA12 | bidirectional | MCU PA12 I/O, FT type: 5 V-tolerant I/O. |
| 56 | PA13 | bidirectional | MCU PA13 / SWDIO (system debug data), FT type: 5 V-tolerant I/O. |
| 57 | PA14 | bidirectional | MCU PA14 / SWDCLK (system debug clock), FT type: 5 V-tolerant I/O. |
| 58 | PA15 | bidirectional | MCU PA15 I/O, FT type: 5 V-tolerant I/O. |
| 59 | PB3 | bidirectional | MCU PB3 I/O, FT type: 5 V-tolerant I/O. |
| 60 | PB4 | bidirectional | MCU PB4 I/O, FT type: 5 V-tolerant I/O. |
| 61 | PB5 | bidirectional | MCU PB5 I/O, FT type: 5 V-tolerant I/O. |
| 62 | PB6 | bidirectional | MCU PB6 I/O, FTf type: 5 V-tolerant and FM+ capable. |
| 63 | PB7 | bidirectional | MCU PB7 I/O, FTf type: 5 V-tolerant and FM+ capable. |
| 64 | BOOT0 | input | Dedicated BOOT0 pin for boot memory selection. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | TQFP-64(10x10) |
| Category | Embedded Processors & Controllers |
| Pins | 64 |
CAD (KiCad official)
- Symbol:
STSPIN32F0601TR - Footprint:
Package_QFP:TQFP-64_10x10mm_P0.5mm - 3D model: TQFP-64(10x10) (KiCad packages3D, STEP)
- 3D model files:
stspin32f0601tr-etched.step/stspin32f0601tr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);stspin32f0601tr.step/stspin32f0601tr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (32 pp, sha256
0d817a2e1b19f4a0, retrieved 2026-10-08, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).