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STPS40150CG

STMicroelectronics · Schottky Diodes · D2PAK

STPS40150CG from STMicroelectronics, in a D2PAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of diode 1 of the dual Schottky rectifier (2 x 20 A average forward current, VRRM 150 V).
2 K passive Common cathode of both diodes, connected to the center tab (the tab is also K).
3 A2 passive Anode of diode 2 of the dual Schottky rectifier (2 x 20 A average forward current, VRRM 150 V).

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package D2PAK
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 150 V 2
Forward rms current IF(RMS) 60 A 2
Average forward current per diode IF(AV) 20 A δ = 0.5, square wave, TC = 150 °C, per diode 2
Average forward current per device IF(AV) 40 A δ = 0.5, square wave, TC = 145 °C, per device 2
Surge non repetitive forward current IFSM 250 A tp = 10 ms sinusoidal 2
Repetitive peak avalanche power PARM 1015 W tp = 10 µs, Tj = 125 °C 2
Storage temperature range Tstg -65 175 °C 2
Maximum operating junction temperature Tj 175 °C 2
Thermal resistance junction to case, per diode Rth(j-c) 1.2 °C/W Per diode 2
Thermal resistance junction to case, total Rth(j-c) 0.85 °C/W Total 2
Thermal resistance coupling Rth(c) 0.5 °C/W 2
Reverse leakage current IR 2 8 µA Tj = 25 °C, VR = VRRM, tp = 5 ms, δ < 2% 2
Reverse leakage current IR 2 11 mA Tj = 125 °C, VR = VRRM, tp = 5 ms, δ < 2% 2
Forward voltage drop VF 0.92 V Tj = 25 °C, IF = 20 A, tp = 380 µs, δ < 2% 2
Forward voltage drop VF 0.69 0.75 V Tj = 125 °C, IF = 20 A, tp = 380 µs, δ < 2% 2
Forward voltage drop VF 1 V Tj = 25 °C, IF = 40 A, tp = 380 µs, δ < 2% 2
Forward voltage drop VF 0.79 0.86 V Tj = 125 °C, IF = 40 A, tp = 380 µs, δ < 2% 2

CAD (KiCad official)

  • Symbol: STPS40150CG
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: D2PAK (KiCad packages3D, STEP)
  • 3D model files: stps40150cg-etched.step / stps40150cg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stps40150cg.step / stps40150cg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (15 pp, sha256 c76a4d5f91b9687b, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF