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Contents

README

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STPS2H100U

STMicroelectronics · Schottky Barrier Diodes (SBD) · SMB

STPS2H100U from STMicroelectronics, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse leakage current IR 1 µA Tj = 25 °C; VR = VRRM; tp = 5 ms, δ < 2% 2
Reverse leakage current IR 0.4 1 mA Tj = 125 °C; VR = VRRM; tp = 5 ms, δ < 2% 2
Forward voltage drop VF 0.79 V Tj = 25 °C; IF = 2 A; tp = 380 µs, δ < 2% 2
Forward voltage drop VF 0.6 0.65 V Tj = 125 °C; IF = 2 A; tp = 380 µs, δ < 2% 2
Forward voltage drop VF 0.88 V Tj = 25 °C; IF = 4 A; tp = 380 µs, δ < 2% 2
Forward voltage drop VF 0.69 0.74 V Tj = 125 °C; IF = 4 A; tp = 380 µs, δ < 2% 2
Repetitive peak reverse voltage VRRM 100 V 2
Average forward current (SMB) IF(AV) 2 A TL = 130 °C; δ = 0.5 2
Surge non repetitive forward current IFSM 75 A tp = 10 ms sinusoidal 2
Repetitive peak avalanche power PARM 2400 W tp = 1 µs; Tj = 25 °C 2
Storage temperature range Tstg -65 175 °C 2
Operating junction temperature range Tj -40 175 °C Condition to avoid thermal runaway for a diode on its own heatsink 2
Junction to lead thermal resistance (SMB) Rth(j-l) 25 °C/W Junction to lead, SMB 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMB) 5

CAD (KiCad official)

  • Symbol: STPS2H100U
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: stps2h100u-etched.step / stps2h100u-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stps2h100u.step / stps2h100u.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (9 pp, sha256 bf42331815d38cb4, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF